Semiconductor device and method for manufacturing the same

ABSTRACT

An object is to improve field effect mobility of a thin film transistor using an oxide semiconductor. Another object is to suppress increase in off current even in a thin film transistor with improved field effect mobility. In a thin film transistor using an oxide semiconductor layer, by forming a semiconductor layer having higher electrical conductivity and a smaller thickness than the oxide semiconductor layer between the oxide semiconductor layer and a gate insulating layer, field effect mobility of the thin film transistor can be improved, and increase in off current can be suppressed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device using an oxidesemiconductor, a display device using the semiconductor device, and amanufacturing method thereof.

2. Description of the Related Art

In recent years, liquid crystal display devices typified by liquidcrystal displays are becoming widespread. As a liquid crystal display,an active matrix liquid crystal display device provided with pixels eachincluding a thin film transistor (TFT) is often used. In a thin filmtransistor included in an active matrix liquid crystal display device,amorphous silicon or polycrystalline silicon is used as an active layer.Although a thin film transistor using amorphous silicon has low fieldeffect mobility, it can be easily formed over a large-sized substratesuch as a large glass substrate. On the other hand, although a thin filmtransistor using polycrystalline silicon has high field effect mobility,it takes an enormous amount of time to form the thin film transistorusing polycrystalline silicon over a large-sized substrate such as alarge glass substrate because a crystallization process such as laserannealing is needed.

In view of the foregoing, techniques in which a thin film transistor ismanufactured using an oxide semiconductor instead of the above siliconmaterial and applied to electronic devices or optical devices haveattracted attention. For example, Patent Document 1 and Patent Document2 disclose a technique in which a thin film transistor is manufacturedusing zinc oxide or an In—Ga—Zn—O-based oxide semiconductor for an oxidesemiconductor film and such a transistor is used as a switching elementor the like of an image display device.

CITATION LIST Patent Document

-   [Patent Document 1] Japanese Published Patent Application No.    2007-123861-   [Patent Document 2] Japanese Published Patent Application No.    2007-96055

The field effect mobility of a thin film transistor using an oxidesemiconductor in a channel formation region is about 10 to 100 times ashigh as that of a thin film transistor using amorphous silicon. Theoxide semiconductor film can be formed by a sputtering method or thelike at a temperature of 300° C. or lower. Its manufacturing process iseasier than that of a thin film transistor using polycrystallinesilicon. Thus, a pixel portion and a peripheral driver circuit of adisplay device can be formed over the same substrate even in the casewhere a large-sized substrate is used.

In an active matrix liquid crystal display device, since voltage isapplied to a liquid crystal layer and electricity is stored in a storagecapacitor in a short gate switching period, a large amount of drivecurrent is necessary. In particular, in a liquid crystal display devicewith a large screen or a high-definition liquid crystal display device,a larger amount of drive current is necessary. Therefore, a thin filmtransistor used as a switching element preferably has high field effectmobility.

However, a thin film transistor using an oxide semiconductor has lowerfield effect mobility than a thin film transistor using polycrystallinesilicon, which has been conventionally used for a driver circuit of aliquid crystal display device.

SUMMARY OF THE INVENTION

An object of an embodiment of the present invention is to improve fieldeffect mobility of a thin film transistor using an oxide semiconductor.Another object of an embodiment of the present invention is to suppressincrease in off current of a thin film transistor with improved fieldeffect mobility. Another object of an embodiment of the presentinvention is to provide a display device including a thin filmtransistor using the oxide semiconductor.

According to an embodiment of the present invention, in forming a thinfilm transistor, an oxide semiconductor layer is used, and asemiconductor layer having higher electrical conductivity and a smallerthickness than the oxide semiconductor layer is formed between the oxidesemiconductor layer and a gate insulating layer.

An embodiment of the present invention is a semiconductor deviceincluding: a gate electrode layer; a gate insulating layer over the gateelectrode layer; a semiconductor layer over the gate insulating layer;an oxide semiconductor layer over the semiconductor layer; and a sourceand drain electrode layers over the oxide semiconductor layer, in whichthe oxide semiconductor layer is an oxide semiconductor layer containingindium, gallium, and zinc; the thickness of the semiconductor layer issmaller than the thickness of the oxide semiconductor layer; theelectrical conductivity of the semiconductor layer is higher than theelectrical conductivity of the oxide semiconductor layer; and the oxidesemiconductor layer and the source and drain electrode layers areelectrically connected.

Another embodiment of the present invention is a semiconductor deviceincluding: a gate electrode layer; a gate insulating layer over the gateelectrode layer; a semiconductor layer over the gate insulating layer;an oxide semiconductor layer over the semiconductor layer; a bufferlayer having n-type conductivity over the oxide semiconductor layer; anda source and drain electrode layers over the buffer layer, in which theoxide semiconductor layer and the buffer layer are oxide semiconductorlayers each containing indium, gallium, and zinc; the carrierconcentration of the buffer layer is higher than the carrierconcentration of the oxide semiconductor layer; the thickness of thesemiconductor layer is smaller than the thickness of the oxidesemiconductor layer; the electrical conductivity of the semiconductorlayer is higher than the electrical conductivity of the oxidesemiconductor layer; the electrical conductivity of the buffer layer ishigher than the electrical conductivity of the semiconductor layer; andthe oxide semiconductor layer and the source and drain electrode layersare electrically connected through the buffer layer.

Note that the semiconductor layer is preferably an oxide semiconductorlayer containing indium, gallium, and zinc. The electrical conductivityof the semiconductor layer is preferably higher than 1.0×10⁻³ S/cm. Theoxide semiconductor layer preferably has a region which is between thesource and drain electrode layers and whose thickness is smaller thanthe thickness of a region overlapping with the source and drainelectrode layers. The carrier concentration of the barrier layer ispreferably 1×10¹⁸/cm³ or higher and the carrier concentration of theoxide semiconductor layer is preferably lower than 1×10¹⁷/cm³.

Another embodiment of the present invention is a method formanufacturing a semiconductor device, including the steps of: forming agate electrode layer over a substrate; forming a gate insulating layerover the gate electrode layer; forming a first oxide semiconductor filmcontaining indium, gallium, and zinc over the gate insulating layer by asputtering method; forming a second oxide semiconductor film containingindium, gallium, and zinc over the first oxide semiconductor film by asputtering method; etching the first oxide semiconductor film and thesecond oxide semiconductor film to form a semiconductor layer and anisland-shaped second oxide semiconductor film; forming a conductivelayer over the semiconductor layer and the island-shaped second oxidesemiconductor film; and etching the island-shaped second oxidesemiconductor film and the conductive layer to form an oxidesemiconductor layer and a source and drain electrode layers, in whichthe proportion of the flow rate of an oxygen gas in a film-forming gasfor forming the first oxide semiconductor film is made lower than theproportion of the flow rate of an oxygen gas in a film-forming gas forforming the second oxide semiconductor film.

Note that the proportion of the flow rate of the oxygen gas in thefilm-forming gas for forming the first oxide semiconductor film ispreferably lower than 10 volume %, and the proportion of the flow rateof the oxygen gas in the film-forming gas for forming the second oxidesemiconductor film is preferably 10 volume % or higher. Further, thefirst oxide semiconductor film is preferably formed in an argon gasatmosphere, and the second oxide semiconductor film is preferably formedin an atmosphere of an argon gas and an oxygen gas. Furthermore, aregion whose thickness is smaller than the thickness of a regionoverlapping with the source and the drain electrode layers is preferablyprovided between the source and drain electrode layers in the oxidesemiconductor layer.

As an oxide semiconductor used in this specification, a thin filmincluding a material whose composition formula is represented as InMO₃(ZnO)_(m) (m>0) is formed, and a thin film transistor including the thinfilm is manufactured. Note that M denotes one or more of metal elementsselected from gallium (Ga), iron (Fe), nickel (Ni), manganese (Mn), andcobalt (Co). In addition to a case where only Ga is contained as M,there is a case where Ga and the above metal elements other than Ga, forexample, Ga and Ni or Ga and Fe are contained as M. Moreover, in theoxide semiconductor, in some cases, a transition metal element such asFe or Ni or an oxide of the transition metal is contained as an impurityelement in addition to a metal element contained as M. In thisspecification, this thin film is also referred to as an“In—Ga—Zn—O-based non-single-crystal film”.

An amorphous structure is observed in the In—Ga—Zn—O-basednon-single-crystal film by X-ray diffraction (XRD). Note that heattreatment is performed on the In—Ga—Zn—O non-single-crystal film of theexamined sample at 200° C. to 500° C., typically 300° C. to 400° C., for10 minutes to 100 minutes after the film is formed by a sputteringmethod. In addition, a thin film transistor having electricalcharacteristics such as an on/off ratio of greater than or equal to 10⁹and a mobility of greater than or equal to 10 at a gate voltage of ±20 Vcan be manufactured.

Note that the ordinal numbers such as “first” and “second” in thisspecification are used for convenience and do not denote the order ofsteps and the stacking order of layers. In addition, the ordinal numbersin this specification do not denote particular names which specify theinvention.

Note that the semiconductor devices in this specification indicate allthe devices which can operate by using semiconductor characteristics,and an electronic optical device, a semiconductor circuit, and anelectronic device are all included in the semiconductor devices.

According to an embodiment of the present invention, in a thin filmtransistor using an oxide semiconductor layer, a semiconductor layerhaving higher electrical conductivity and a smaller thickness than theoxide semiconductor layer is formed between the oxide semiconductorlayer and a gate insulating layer, whereby field effect mobility of thethin film transistor can be improved. In addition, increase in offcurrent can be suppressed even in the thin film transistor with improvedfield effect mobility.

Another embodiment of the present invention can provide a display devicewith high electrical characteristics and high reliability by using thethin film transistor for a pixel portion and a driver circuit portion ofthe display device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams illustrating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 2A to 2C are diagrams illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIGS. 3A to 3C are diagrams illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIG. 4 is a diagram illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIG. 5 is a diagram illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIG. 6 is a diagram illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIG. 7 is a diagram illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIGS. 8A-1 to 8B-2 are diagrams illustrating a semiconductor deviceaccording to an embodiment of the present invention.

FIG. 9 is a diagram illustrating a semiconductor device according to anembodiment of the present invention.

FIG. 10 is a diagram illustrating a semiconductor device according to anembodiment of the present invention.

FIGS. 11A to 11C are diagrams illustrating a method for manufacturing asemiconductor device according to an embodiment of the presentinvention.

FIG. 12 is a graph showing measurement results of electricalconductivity of an oxide semiconductor layer.

FIG. 13 is a diagram illustrating a semiconductor device according to anembodiment of the present invention.

FIGS. 14A and 14B are block diagrams each illustrating a semiconductordevice.

FIG. 15 is a diagram illustrating a configuration of a signal linedriver circuit.

FIG. 16 is a timing chart illustrating operation of a signal line drivercircuit.

FIG. 17 is a timing chart illustrating operation of a signal line drivercircuit.

FIG. 18 is a diagram illustrating a configuration of a shift register.

FIG. 19 is a diagram illustrating a connection structure of a flip-flopin FIG. 18.

FIG. 20 is a diagram illustrating a pixel equivalent circuit of asemiconductor device according to an embodiment of the presentinvention.

FIGS. 21A to 21C are diagrams each illustrating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 22A-1 to 22B are diagrams illustrating a semiconductor deviceaccording to an embodiment of the present invention.

FIG. 23 is a diagram illustrating a semiconductor device according to anembodiment of the present invention.

FIGS. 24A and 24B are diagrams illustrating a semiconductor deviceaccording to an embodiment of the present invention.

FIGS. 25A and 25B are diagrams each illustrating an example of a usagepattern of electronic paper.

FIG. 26 is an external view of an example of an electronic book reader.

FIG. 27A is an external view of an example of a television device andFIG. 27B is an external view of an example of a digital photo frame.

FIGS. 28A and 28B are external views each illustrating an example of anamusement machine.

FIGS. 29A and 29B are diagrams each illustrating an example of a mobilephone.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments and an example of the present invention will be describedwith reference to the drawings. However, the present invention is notlimited to the following description, and it is easily understood bythose skilled in the art that the mode and detail can be variouslychanged without departing from the spirit and scope of the presentinvention. Therefore, the present invention is not interpreted as beinglimited to the following description of the embodiments and example.Note that, in all the drawings for explaining the embodiments andexample, the same portions or portions having the same functions aredenoted by the same reference numerals, and the description thereof willbe made only once.

Embodiment 1

In this embodiment, a structure of a thin film transistor is describedwith reference to FIGS. 1A and 1B.

A thin film transistor having a bottom gate structure of this embodimentis illustrated in FIGS. 1A and 1B. FIG. 1A is a cross-sectional view,and FIG. 1B is a plan view. FIG. 1A is a cross-sectional view along lineA1-A2 of FIG. 1B.

In the thin film transistor illustrated in FIGS. 1A and 1B, a gateelectrode layer 101 is provided over a substrate 100; a gate insulatinglayer 102 is provided over the gate electrode layer 101; a semiconductorlayer 106 is provided over the gate insulating layer 102; an oxidesemiconductor layer 103 is provided over the semiconductor layer 106;and a source and drain electrode layers 105 a and 105 b are providedover the oxide semiconductor layer 103.

The gate electrode layer 101 can be formed to have a single-layerstructure or a stacked-layer structure using a metal material such asaluminum, copper, molybdenum, titanium, chromium, tantalum, tungsten,neodymium, or scandium; an alloy material containing any of thesematerials as its main component; or a nitride containing any of thesematerials. The gate electrode layer 101 is desirably formed using alow-resistance conductive material such as aluminum or copper; however,the low-resistance conductive material has disadvantages of low heatresistance and being easily eroded. Thus, the low-resistance conductivematerial is preferably used in combination with a heat-resistantconductive material. As the heat-resistant conductive material,molybdenum, titanium, chromium, tantalum, tungsten, neodymium, scandium,or the like is used.

For example, as a stacked-layer structure of the gate electrode layer101, a two-layer structure in which a molybdenum layer is stacked overan aluminum layer, a two-layer structure in which a molybdenum layer isstacked over a copper layer, a two-layer structure in which a titaniumnitride layer or a tantalum nitride layer is stacked over a copperlayer, or a two-layer structure in which a titanium nitride layer and amolybdenum layer are stacked is preferable. Alternatively, a three-layerstructure in which a tungsten layer or a tungsten nitride layer, analuminum-silicon alloy layer or an aluminum-titanium alloy layer, and atitanium nitride layer or a titanium layer are stacked is preferablyused.

The oxide semiconductor layer 103 is formed using an In—Ga—Zn—O-basednon-single-crystal film which contains In, Ga, and Zn and includes amaterial whose composition formula is represented as InMO₃ (ZnO)_(m)(m>0). Note that M denotes one or more of metal elements selected fromgallium (Ga), iron (Fe), nickel (Ni), manganese (Mn), and cobalt (Co).In addition to a case where only Ga is contained as M, there is a casewhere Ga and the above metal elements other than Ga, for example, Ga andNi or Ga and Fe are contained as M. Moreover, in the oxidesemiconductor, in some cases, a transition metal element such as Fe orNi or an oxide of the transition metal is contained as an impurityelement in addition to a metal element contained as M.

The thickness of the oxide semiconductor layer 103 is set to 10 nm to300 nm, preferably, 20 nm to 100 nm. The oxide semiconductor layer 103has a region which is between the source and drain electrode layers 105a and 105 b and has a smaller thickness than a region overlapping withthe source and drain electrode layers 105 a and 105 b.

The electrical conductivity of the oxide semiconductor layer 103 ispreferably 1.0×10³ S/cm or lower. In addition, the electricalconductivity of the oxide semiconductor layer 103 is preferably1.0×10⁻¹¹ S/cm or higher. The range of the carrier concentration of theoxide semiconductor layer 103 is preferably lower than 1×10¹⁷/cm³ (morepreferably, 1×10¹¹/cm³ or higher). When the carrier concentration of theoxide semiconductor layer 103 exceeds the above range, the thin filmtransistor has a risk of being normally-on.

The electrical conductivity of the semiconductor layer 106 is higherthan that of the oxide semiconductor layer 103, and the thickness of thesemiconductor layer 106 is smaller than that of the oxide semiconductorlayer 103. The electrical conductivity of the semiconductor layer 106 ispreferably higher than 1.0×10⁻³ S/cm. The thickness of the semiconductorlayer 106 is set to greater than or equal to 1 nm and less than or equalto 50 nm, preferably, greater than or equal to 5 nm and less than orequal to 10 nm. Here, since the thickness of the semiconductor layer 106is smaller than that of the oxide semiconductor layer 103, drain currentflows mainly through an etched portion of the oxide semiconductor layer103 when the thin film transistor is turned off; thus, off current doesnot flow through the semiconductor layer 106 having high electricalconductivity, whereby increase in off current is suppressed.

In this embodiment, an In—Ga—Zn—O-based non-single-crystal film is usedas the semiconductor layer 106. In the case where an In—Ga—Zn—O-basednon-single-crystal film is used as the semiconductor layer 106, at leastan amorphous component is included in the In—Ga—Zn—O-basednon-single-crystal film, and crystal grains (nanocrystals) are includedin the amorphous structure of the semiconductor layer 106 in some cases.The crystal grains (nanocrystals) in the semiconductor layer 106 eachhave a diameter of 1 nm to 10 nm, typically, about 2 nm to 4 nm.However, the semiconductor layer 106 is not limited to theIn—Ga—Zn—O-based non-single-crystal film. A semiconductor withoutincluding the In—Ga—Zn—O-based non-single-crystal such as an oxidesemiconductor, a single crystal semiconductor, a polycrystallinesemiconductor, a microcrystalline semiconductor, an amorphoussemiconductor, or a compound semiconductor can be used as long as itsatisfies the above condition. When the In—Ga—Zn—O-basednon-single-crystal film is used as the semiconductor layer 106, theoxide semiconductor layer 103 and the semiconductor layer 106 can besuccessively formed; therefore, efficiency in manufacturing the thinfilm transistor and productivity can be improved.

In the case where the In—Ga—Zn—O-based non-single-crystal film is usedas the semiconductor layer 106, the proportion of the flow rate of anoxygen gas in the whole film-forming gas for forming the semiconductorlayer 106 by sputtering is made lower than that of the flow rate of anoxygen gas in the whole film-forming gas for forming the oxidesemiconductor layer 103 by sputtering. Accordingly, the electricalconductivity of the thus-formed semiconductor layer 106 can be madehigher than that of the thus-formed oxide semiconductor layer 103. Thesemiconductor layer 106 is preferably formed under a condition where theproportion of the flow rate of the oxygen gas in the whole film-forminggas is lower than 10 volume %. The oxide semiconductor layer 103 ispreferably formed under a condition where the proportion of the flowrate of the oxygen gas in the whole film-forming gas is 10 volume % orhigher. In addition, the semiconductor layer 106 may be formed in anatmosphere of rare gas such as an argon gas without containing an oxygengas.

By employing a stacked-layer structure of the semiconductor layer 106and the oxide semiconductor layer 103 for an active layer of the thinfilm transistor, drain current flows mainly through the semiconductorlayer 106 having high electrical conductivity when the thin filmtransistor is turned on, and the field effect mobility can be increased.Further, drain current flows mainly through an etched portion of theoxide semiconductor layer 103 when the thin film transistor is turnedoff; thus, off current can be prevented from flowing through thesemiconductor layer 106 having high electrical conductivity, wherebyincrease in off current can be suppressed.

The source or drain electrode layer 105 a has a three-layer structure ofa first conductive layer 112 a, a second conductive layer 113 a, and athird conductive layer 114 a while the source or drain electrode layer105 b has a three-layer structure of a first conductive layer 112 b, asecond conductive layer 113 b, and a third conductive layer 114 b. Eachof the first conductive layers 112 a and 112 b, the second conductivelayers 113 a and 113 b, and the third conductive layers 114 a and 114 bcan be formed using a metal material such as aluminum, copper,molybdenum, titanium, chromium, tantalum, tungsten, neodymium, orscandium; an alloy material containing any of these metal materials asits main component; or a nitride containing any of these metalmaterials. Each of the first conductive layers 112 a and 112 b, thesecond conductive layers 113 a and 113 b, and the third conductivelayers 114 a and 114 b is desirably formed using a low-resistanceconductive material such as aluminum or copper; however, thelow-resistance conductive material has disadvantages of low heatresistance and being easily eroded. Thus, the low-resistance conductivematerial is preferably used in combination with a heat-resistantconductive material. As the heat-resistant conductive material,molybdenum, titanium, chromium, tantalum, tungsten, neodymium, scandium,or the like is used.

For example, it is preferable that the first conductive layers 112 a and112 b and the third conductive layers 114 a and 114 b be formed usingtitanium that is a heat-resistant conductive material, and the secondconductive layers 113 a and 113 b be formed using an aluminum alloycontaining neodymium that has low heat resistance. By such a structure,a low resistance property of aluminum is utilized and generation of ahillock can be reduced. Note that, in this embodiment, the source ordrain electrode layer 105 a is formed to have a three-layer structure ofthe first conductive layer 112 a, the second conductive layer 113 a, andthe third conductive layer 114 a while the source or drain electrodelayer 105 b is formed to have a three-layer structure of the firstconductive layer 112 b, the second conductive layer 113 b, and the thirdconductive layer 114 b; however, the source and drain electrode layers105 a and 105 b are not limited to this structure. Thus, the source anddrain electrode layers 105 a and 105 may have a single-layer structure,a two-layer structure, or a stacked structure of four or more layers.

With such a structure, a semiconductor layer having higher electricalconductivity and a smaller thickness than an oxide semiconductor layeris formed between the oxide semiconductor layer serving as an activelayer and a gate insulating layer; thus, field effect mobility can beimproved when a thin film transistor is turned on. Further, increase inoff current can be suppressed even in the thin film transistor withimproved field effect mobility.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 2

In this embodiment, a manufacturing process of a display deviceincluding the thin film transistor described in Embodiment 1 will bedescribed with reference to FIGS. 2A to 2C, FIGS. 3A to 3C, FIG. 4, FIG.5, FIG. 6, FIG. 7, FIGS. 8A-1 to 8B-2, and FIG. 9. FIGS. 2A to 2C andFIGS. 3A to 3C are cross-sectional views, and FIG. 4, FIG. 5, FIG. 6,and FIG. 7 are plan views. Line A1-A2 and line B1-B2 in each of FIG. 4,FIG. 5, FIG. 6, and FIG. 7 correspond to line A1-A2 and line B1-B2 ineach of the cross-sectional views of FIGS. 2A to 2C and FIGS. 3A to 3C,respectively.

First, the substrate 100 is prepared. As the substrate 100, any of thefollowing substrates can be used: non-alkaline glass substrates made ofbarium borosilicate glass, aluminoborosilicate glass, aluminosilicateglass, and the like by a fusion method or a float method; ceramicsubstrates; plastic substrates having heat resistance enough towithstand a process temperature of this manufacturing process; and thelike. Alternatively, a metal substrate such as a stainless steel alloysubstrate, provided with an insulating film over its surface, may alsobe used. The substrate 100 may have a size of 320 mm×400 mm, 370 mm×470mm, 550 mm×650 mm, 600 mm×720 mm, 680 mm×880 mm, 730 mm×920 mm, 1000mm×1200 mm, 1100 mm×1250 mm, 1150 mm×1300 mm, 1500 mm×1800 mm, 1900mm×2200 mm, 2160 mm×2460 mm, 2400 mm×2800 mm, 2850 mm×3050 mm, or thelike.

In addition, an insulating film as a base film may be formed over thesubstrate 100. The base film may be formed to have a single-layerstructure or a stacked-layer structure of any of a silicon oxide film, asilicon nitride film, a silicon oxynitride film, and a silicon nitrideoxide film by a CVD method, a sputtering method, or the like. In thecase where a substrate containing mobile ions such as a glass substrateis used as the substrate 100, a film containing nitrogen such as asilicon nitride film or a silicon nitride oxide film is used as the basefilm, whereby the mobile ions can be prevented from entering the oxidesemiconductor layer or the semiconductor layer.

Next, a conductive film for forming a gate wiring including the gateelectrode layer 101, a capacitor wiring 108, and a first terminal 121 isformed over the entire area over the substrate 100 by a sputteringmethod or a vacuum evaporation method. Next, after the conductive filmis formed over the entire area over the substrate 100, a firstphotolithography step is performed. A resist mask is formed, andunnecessary portions are removed by etching to form wirings and anelectrode (a gate wiring including the gate electrode layer 101, thecapacitor wiring 108, and the first terminal 121). At that time, etchingis preferably performed so that at least an end portion of the gateelectrode layer 101 is tapered for prevention of disconnection. Across-sectional view at this stage is illustrated in FIG. 2A. Note thata plan view at this stage corresponds to FIG. 4.

The gate wiring including the gate electrode layer 101, the capacitorwiring 108, and the first terminal 121 in a terminal portion can beformed to have a single-layer structure or a stacked-layer structureusing a metal material such as aluminum, copper, molybdenum, titanium,chromium, tantalum, tungsten, neodymium, or scandium; an alloy materialcontaining any of these metal materials as its main component; or anitride containing any of these metal materials. The gate wiringincluding the gate electrode layer 101, the capacitor wiring 108, andthe first terminal 121 in the terminal portion are desirably formedusing a low-resistance conductive material such as aluminum or copper;however, the low-resistance conductive material has disadvantages of lowheat resistance and being easily eroded. Thus, the low-resistanceconductive material is preferably used in combination with aheat-resistant conductive material. As the heat-resistant conductivematerial, molybdenum, titanium, chromium, tantalum, tungsten, neodymium,scandium, or the like is used.

For example, as a stacked-layer structure of the gate electrode layer101, a two-layer structure in which a molybdenum layer is stacked overan aluminum layer, a two-layer structure in which a molybdenum layer isstacked over a copper layer, a two-layer structure in which a titaniumnitride layer or a tantalum nitride layer is stacked over a copperlayer, or a two-layer structure in which a molybdenum layer and atitanium nitride layer are stacked is preferable. Alternatively, athree-layer structure in which a tungsten layer or a tungsten nitridelayer, an aluminum-silicon alloy layer or an aluminum-titanium alloylayer, and a titanium nitride layer or a titanium layer are stacked ispreferable.

Next, the gate insulating layer 102 is formed over the entire area overthe gate electrode layer 101. The gate insulating layer 102 is formed bya CVD method, a sputtering method, or the like to a thickness of 50 nmto 250 nm.

For example, the gate insulating layer 102 is formed using a siliconoxide film with a thickness of 100 nm by a CVD method or a sputteringmethod. Needless to say, the gate insulating layer 102 is not limited tosuch a silicon oxide film. The gate insulating layer 102 may be formedto have a single-layer structure or a stacked-layer structure usinganother insulating film such as a silicon oxynitride film, a siliconnitride oxide film, a silicon nitride film, an aluminum oxide film, or atantalum oxide film.

Alternatively, the gate insulating layer 102 can be formed of a siliconoxide layer by a CVD method using an organosilane gas. As theorganosilane gas, a silicon-containing compound such astetraethoxysilane (TEOS: chemical formula, Si(OC₂H₅)₄),tetramethylsilane (TMS: chemical formula, Si(CH₃)₄),tetramethylcyclotetrasiloxane (TMCTS), octamethylcyclotetrasiloxane(OMCTS), hexamethyldisilazane (HMDS), triethoxysilane (SiH(OC₂H₅)₃), ortrisdimethylaminosilane (SiH(N(CH₃)₂)₃) can be used.

Further alternatively, the gate insulating layer 102 may be formed usingone kind of oxide, nitride, oxynitride, or nitride oxide of aluminum,yttrium, or hafnium; or a compound including at least two or more kindsof the aforementioned compounds.

Note that in this specification, oxynitride refers to a substance thatcontains more oxygen atoms than nitrogen atoms and nitride oxide refersto a substance that contains more nitrogen atoms than oxygen atoms. Forexample, a “silicon oxynitride film” means a film that contains moreoxygen atoms than nitrogen atoms, and oxygen, nitrogen, silicon, andhydrogen at concentrations ranging from 50 atomic % to 70 atomic %, 0.5atomic % to 15 atomic %, 25 atomic % to 35 atomic %, and 0.1 atomic % to10 atomic %, respectively, when they are measured by RBS (RutherfordBackscattering Spectrometry) and HFS (Hydrogen Forward Scattering).Further, a “silicon nitride oxide film” means a film that contains morenitrogen atoms than oxygen atoms, and oxygen, nitrogen, silicon, andhydrogen at concentrations ranging from 5 atomic % to 30 atomic %, 20atomic % to 55 atomic %, 25 atomic % to 35 atomic %, and 10 atomic % to30 atomic %, respectively, when they are measured by RBS and HFS. Notethat percentages of nitrogen, oxygen, silicon, and hydrogen fall withinthe ranges given above, where the total number of atoms contained in thesilicon oxynitride or the silicon nitride oxide is defined as 100 atomic%.

Note that, before oxide semiconductor films for forming the oxidesemiconductor layer 103 and the semiconductor layer 106 are formed,reverse sputtering by which plasma is generated by introducing an argongas is preferably performed, whereby dust attached to a surface of thegate insulating layer 102 is removed. The reverse sputtering refers to amethod in which, without application of voltage to a target side, an RFpower source is used for application of voltage to a substrate side inan argon atmosphere to modify a surface. Note that instead of an argonatmosphere, a nitrogen atmosphere, a helium atmosphere, or the like maybe used. Alternatively, an argon atmosphere to which oxygen, hydrogen,N₂O, or the like is added may be used. Further alternatively, an argonatmosphere to which Cl₂, CF₄, or the like is added may be used. Afterthe reverse sputtering, a first oxide semiconductor film is formedwithout being exposed to air, whereby dust or moisture can be preventedfrom attaching to an interface between the gate insulating layer 102 andthe semiconductor layer 106.

Next, over the gate insulating layer 102, the first oxide semiconductorfilm (a first In—Ga—Zn—O-based non-single-crystal film in thisembodiment) for forming the semiconductor layer 106 is formed by asputtering method in an atmosphere of rare gas such as an argon gas andan oxygen gas. Note that the oxygen gas is not necessarily needed. Asspecific conditions, an oxide semiconductor target containing In, Ga,and Zn (In₂O₃:Ga₂O₃:ZnO=1:1:1) of 8 inches in diameter is used, thedistance between the substrate and the target is set to 170 mm, a flowrate ratio of Ar to O₂ is 50 to 1 (sccm), and film formation isperformed by sputtering at a pressure of 0.4 Pa, with a direct-current(DC) power source of 0.5 kW, and at room temperature. Further, as thetarget, Ga₂O₃ and ZnO in a pellet state may be disposed on a disk of 8inches in diameter which contains In₂O₃.

Despite the intentional use of the target of In₂O₃:Ga₂O₃:ZnO=1:1:1, anIn—Ga—Zn—O-based non-single-crystal film including crystal grains with asize of 1 nm to 10 nm immediately after the film formation may beformed. Note that it can be said that the presence or absence of crystalgrains or the density of crystal grains can be adjusted and the diametersize can be adjusted within the range of 1 nm to 10 nm by appropriateadjustment of the composition ratio in the target, the film formingpressure (0.1 Pa to 2.0 Pa), the power (250 W to 3000 W: 8 inches ø),the temperature (room temperature to 100° C.), the reactive sputteringfilm formation conditions, or the like. The thickness of the firstIn—Ga—Zn—O-based non-single-crystal film is set to 1 nm to 50 nm,preferably, 5 nm to 10 nm. Needless to say, when the film includescrystal grains, the size of the crystal grains does not exceed thethickness of the film. Further, a pulsed direct current (DC) powersource is preferable because dust can be reduced and a thicknessdistribution is uniform.

By using the In—Ga—Zn—O-based non-single-crystal film as thesemiconductor layer 106, the first oxide semiconductor film and a secondoxide semiconductor film can be successively formed. Therefore,efficiency in manufacturing the display device and productivity can beimproved. Note that although the semiconductor layer 106 is formed usingthe In—Ga—Zn—O-based non-single-crystal film in this embodiment, thesemiconductor layer 106 is not limited thereto; thus, a semiconductorwithout including the In—Ga—Zn—O-based non-single-crystal such as anoxide semiconductor, a single crystal semiconductor, a polycrystallinesemiconductor, a microcrystalline semiconductor, an amorphoussemiconductor, or a compound semiconductor can be used as thesemiconductor layer 106.

Next, the second oxide semiconductor film (a second In—Ga—Zn—O-basednon-single-crystal film in this embodiment) for forming the oxidesemiconductor layer 103 is formed by a sputtering method without beingexposed to air in an atmosphere of rare gas such as an argon gas and anoxygen gas. As specific conditions, an oxide semiconductor targetcontaining In, Ga, and Zn (In₂O₃:Ga₂O₃:ZnO=1:1:1) of 8 inches indiameter is used, the distance between the substrate and the target isset to 170 mm, a flow rate ratio of Ar to O₂ is 50 to 5 (sccm), and filmformation is performed by sputtering at a pressure of 0.4 Pa, with adirect-current (DC) power source of 0.5 kW, and at room temperature.Further, as the target, Ga₂O₃ and ZnO in a pellet state may be disposedon a disk of 8 inches in diameter which contains In₂O₃. Note that apulsed direct current (DC) power source is preferably used because dustcan be reduced and a thickness distribution is uniform. The thickness ofthe second In—Ga—Zn—O-based non-single-crystal film is set to 10 nm to300 nm, preferably, 20 nm to 100 nm.

The proportion of the flow rate of the oxygen gas in the wholefilm-forming gas for forming the first In—Ga—Zn—O-basednon-single-crystal film by sputtering is made lower than that of theflow rate of the oxygen gas in the whole film-forming gas for formingthe second In—Ga—Zn—O-based non-single-crystal film by sputtering.Accordingly, the electrical conductivity of the thus-formed firstIn—Ga—Zn—O-based non-single-crystal film can be higher than that of thethus-formed second In—Ga—Zn—O-based non-single-crystal film. As a filmformation condition for the first In—Ga—Zn—O-based non-single-crystalfilm, the proportion of the flow rate of the oxygen gas in the wholefilm-forming gas is preferably lower than 10 volume %. Further, as afilm formation condition for the second In—Ga—Zn—O-basednon-single-crystal film, the proportion of the flow rate of the oxygengas in the whole film-forming gas is preferably 10 volume % or higher.Further, the first In—Ga—Zn—O-based non-single-crystal film may beformed in an atmosphere of rare gas such as an argon gas withoutcontaining an oxygen gas.

A chamber used for forming the second In—Ga—Zn—O-basednon-single-crystal film may be the same or different from the chamber inwhich the reverse sputtering has been performed.

Examples of a sputtering method include an RF sputtering method in whicha high-frequency power source is used for a sputtering power source, aDC sputtering method, and a pulsed DC sputtering method in which a biasis applied in a pulsed manner. An RF sputtering method is mainly used inthe case of forming an insulating film, and a DC sputtering method ismainly used in the case of forming a metal film.

In addition, there is also a multi-source sputtering apparatus in whicha plurality of targets of different materials can be set. With themulti-source sputtering apparatus, films of different materials can beformed to be stacked in the same chamber, or a plurality of kinds ofmaterials can be formed by electric discharge at the same time in thesame chamber.

In addition, there are a sputtering apparatus provided with a magnetsystem inside the chamber and used for a magnetron sputtering method, ora sputtering apparatus used for an ECR sputtering method in which plasmagenerated with the use of microwaves is used without using glowdischarge.

In addition, as a film formation method by sputtering, there are also areactive sputtering method in which a target substance and a sputteringgas component are chemically reacted with each other during filmformation to form a thin compound film thereof, and a bias sputteringmethod in which voltage is also applied to a substrate during filmformation.

Next, a second photolithography step is performed. A resist mask isformed, and the first In—Ga—Zn—O-based non-single-crystal film and thesecond In—Ga—Zn—O-based non-single-crystal film are etched. In etchingof the first In—Ga—Zn—O-based non-single-crystal film and the secondIn—Ga—Zn—O-based non-single-crystal film, organic acid such as citricacid or oxalic acid can be used for etchant. Here, the firstIn—Ga—Zn—O-based non-single-crystal film and the second In—Ga—Zn—O-basednon-single-crystal film are etched by wet etching with use of ITO07N(manufactured by KANTO CHEMICAL CO., INC.) to remove an unnecessaryportion. Thus, the first In—Ga—Zn—O-based non-single-crystal film andthe second In—Ga—Zn—O-based non-single-crystal film are processed intoan island shape, whereby the semiconductor layer 106 formed from thefirst In—Ga—Zn—O-based non-single-crystal film and an oxidesemiconductor film 111 which is the second In—Ga—Zn—O-basednon-single-crystal film are formed. The semiconductor layer 106 and theoxide semiconductor film 111 are etched to have a tapered edge, wherebydisconnection of a wiring due to a step shape can be prevented. Notethat etching here is not limited to wet etching and may be dry etching.A cross-sectional view at this stage is illustrated in FIG. 2B. Notethat a plan view at this stage corresponds to FIG. 5.

Next, a third photolithography step is performed. A resist mask isformed, and unnecessary portions are removed by etching to form acontact hole reaching the wiring or the electrode layer which is formedfrom the same material as the gate electrode layer 101. This contacthole is provided for direct contact with the conductive film formedlater. For example, a contact hole is formed when a thin film transistorwhose gate electrode layer is in direct contact with the source or drainelectrode layer in the driver circuit is formed, or when a terminal thatis electrically connected to a gate wiring of a terminal portion isformed.

Next, a first conductive layer 112, a second conductive layer 113, and athird conductive layer 114 are formed over the semiconductor layer 106and the oxide semiconductor film 111 by a sputtering method or a vacuumevaporation method with use of a metal material. A cross-sectional viewat this stage is illustrated in FIG. 2C.

Each of the first conductive layer 112, the second conductive layer 113,and the third conductive layer 114 can be formed using a metal materialsuch as aluminum, copper, molybdenum, titanium, chromium, tantalum,tungsten, neodymium, or scandium; an alloy material containing any ofthese metal materials as its main component; or a nitride containing anyof these metal materials. The first conductive layer 112, the secondconductive layer 113, and the third conductive layer 114 are eachdesirably formed using a low-resistance conductive material such asaluminum or copper; however, the low-resistance conductive material hasdisadvantages of low heat resistance and being easily eroded. Thus, thelow-resistance conductive material is preferably used in combinationwith a heat-resistant conductive material. As the heat-resistantconductive material, molybdenum, titanium, chromium, tantalum, tungsten,neodymium, scandium, or the like is used.

Here, the first conductive layer 112 and the third conductive layer 114are formed using titanium that is a heat-resistant conductive material,and the second conductive layer 113 is formed using an aluminum alloycontaining neodymium. By such a structure, a low resistance property ofaluminum is utilized and generation of a hillock can be reduced. Notethat, in this embodiment, a three-layer structure of the firstconductive layer 112, the second conductive layer 113, and the thirdconductive layer 114 is employed; however, an embodiment of the presentinvention is not limited thereto. Thus, a single-layer structure, atwo-layer structure, or a stacked structure of four or more layers maybe employed. For example, a single-layer structure of a titanium film ora single-layer structure of an aluminum film containing silicon may beemployed.

Next, a fourth photolithography step is performed. A resist mask 131 isformed, and an unnecessary portion is removed by etching, whereby thesource and drain electrode layers 105 a and 105 b, the oxidesemiconductor layer 103, and a connection electrode 120 are formed. Wetetching or dry etching is used as an etching method at this time. Forexample, in the case where the first conductive layer 112 and the thirdconductive layer 114 are formed using titanium and the second conductivelayer 113 is formed using an aluminum alloy containing neodymium, wetetching can be performed by using a hydrogen peroxide solution or heatedhydrochloric acid as etchant. In this etching step, a region to beexposed in the oxide semiconductor film 111 is also partly etched; thus,the oxide semiconductor layer 103 has a region which is between thesource and drain electrode layers 105 a and 105 b and whose thickness issmaller than the thickness of a region overlapping with the source anddrain electrode layer 105 a and 105 b. Accordingly, a channel formationregion of the thin film transistor overlaps with the small-thicknessregion of the oxide semiconductor layer 103.

In FIG. 3A, the first conductive layer 112, the second conductive layer113, the third conductive layer 114, and the oxide semiconductor film111 can be etched at a time by etching in which a hydrogen peroxidesolution or heated hydrochloric acid is used as etchant; therefore, endportions of the source and drain electrode layers 105 a and 105 b arealigned with end portions of the oxide semiconductor layer 103, and acontinuous structure can be formed. In addition, wet etching allows thelayers to be etched isotropically, so that the end portions of thesource and drain electrode layers 105 a and 105 b are recessed from theresist mask 131. Through the above steps, a thin film transistor 170 inwhich the oxide semiconductor layer 103 and the semiconductor layer 106serve as a channel formation region can be manufactured. Across-sectional view at this stage is illustrated in FIG. 3A. Note thata plan view at this stage corresponds to FIG. 6.

Here, heat treatment at 200° C. to 600° C., typically 250° C. to 500°C., is preferably performed. Here, heat treatment is performed in anitrogen atmosphere in a furnace at 350° C. for one hour. Through thisheat treatment, rearrangement at the atomic level occurs in theIn—Ga—Zn—O-based non-single-crystal film. Because strain energy whichinhibits carrier movement is released by the heat treatment, the heattreatment (including optical annealing) is important. Note that there isno particular limitation on the timing of heat treatment as long as itis performed after formation of the second In—Ga—Zn—O-basednon-single-crystal film, and for example, heat treatment may beperformed after formation of a pixel electrode.

Further, the exposed channel formation region of the oxide semiconductorlayer 103 may be subjected to oxygen radical treatment. By performingthe oxygen radical treatment, the thin film transistor can benormally-off In addition, the radical treatment can repair damage due tothe etching of the oxide semiconductor layer 103. The radical treatmentis preferably performed in an atmosphere of O₂ or N₂O, and preferably anatmosphere of N₂, He, or Ar each containing oxygen. Alternatively, theradical treatment may be performed in an atmosphere in which Cl₂ and CF₄are added to the above atmosphere. Note that the radical treatment ispreferably performed with no bias applied.

In the fourth photolithography step, a second terminal 122 made from thesame material as the source and drain electrode layers 105 a and 105 bis also left in the terminal portion. Note that the second terminal 122is electrically connected to a source wiring (a source wiring includingthe source and drain electrode layers 105 a and 105 b).

In the terminal portion, the connection electrode 120 is directlyconnected to the first terminal 121 through the contact hole formed inthe gate insulating layer 102. Note that although not illustrated here,a source or drain wiring of the thin film transistor of the drivercircuit is directly connected to the gate electrode through the samesteps as the above-described steps.

Further, by use of a resist mask having regions with plural thicknesses(typically, two different thicknesses) which is formed using amulti-tone mask, the number of resist masks can be reduced, resulting insimplified process and lower costs.

Next, the resist mask 131 is removed, and a protective insulating layer107 is formed to cover the thin film transistor 170. For the protectiveinsulating layer 107, a silicon nitride film, a silicon oxide film, asilicon oxynitride film, an aluminum oxide film, a tantalum oxide film,or the like which is obtained by a sputtering method or the like can beused.

Next, a fifth photolithography step is performed. A resist mask isformed, and the protective insulating layer 107 is etched to form acontact hole 125 reaching the drain electrode layer 105 b. In addition,by the etching here, a contact hole 127 which reaches the secondterminal 122 and a contact hole 126 which reaches the connectionelectrode 120 are formed. A cross-sectional view at this stage isillustrated in FIG. 3B.

Then, after the resist mask is removed, a transparent conductive film isformed. The transparent conductive film is formed using indium oxide(In₂O₃), an alloy of indium oxide and tin oxide (In₂O₃—SnO₂, abbreviatedas ITO), or the like by a sputtering method, a vacuum evaporationmethod, or the like. Etching treatment of such a material is performedwith a hydrochloric acid based solution. Instead, because a residuetends to be generated particularly in etching of ITO, an alloy of indiumoxide and zinc oxide (In₂O₃—ZnO) may be used in order to improve etchingprocessability.

Next, a sixth photolithography step is performed. A resist mask isformed, and an unnecessary portion is removed by etching to form a pixelelectrode layer 110.

In the sixth photolithography step, a storage capacitor is formed withthe capacitor wiring 108 and the pixel electrode layer 110, in which thegate insulating layer 102 and the protective insulating layer 107 in thecapacitor portion are used as a dielectric.

In addition, in the sixth photolithography step, the first terminal andthe second terminal are covered with the resist mask, and transparentconductive films 128 and 129 are left in the terminal portion. Thetransparent conductive films 128 and 129 serve as electrodes or wiringsthat are used for connection with an FPC. The transparent conductivefilm 128 formed over the connection electrode 120 that is directlyconnected to the first terminal 121 serves as a connection terminalelectrode which functions as an input terminal for the gate wiring. Thetransparent conductive film 129 formed over the second terminal 122serves as a connection terminal electrode which functions as an inputterminal for the source wiring.

Then, the resist mask is removed. A cross-sectional view at this stageis illustrated in FIG. 3C. Note that a plan view at this stagecorresponds to FIG. 7.

Further, FIGS. 8A-1 and 8B-1 are a cross-sectional view of a gate wiringterminal portion at this stage and a top view thereof, respectively.FIG. 8A-1 is a cross-sectional view taken along line C1-C2 of FIG. 8B-1.In FIG. 8A-1, a transparent conductive film 155 formed over a protectiveinsulating film 154 is a connection terminal electrode serving as aninput terminal. Furthermore, in FIG. 8A-1, in the terminal portion, thefirst terminal 151 formed from the same material as the gate wiring anda connection electrode 153 formed from the same material as the sourcewiring are overlapped with each other with a gate insulating layer 152interposed therebetween and are electrically connected. In addition, theconnection electrode 153 and the transparent conductive film 155 are indirect contact with each other through a contact hole provided in theprotective insulating film 154 to form conduction therebetween.

Further, FIGS. 8B-1 and 8B-2 are a cross-sectional view of a sourcewiring terminal portion and a top view thereof, respectively. FIG. 8B-1is a cross-sectional view taken along line D1-D2 of FIG. 8B-2. In FIG.8B-1, the transparent conductive film 155 formed over the protectiveinsulating film 154 is a connection terminal electrode serving as aninput terminal. Furthermore, in FIG. 8B-1, in the terminal portion, anelectrode 156 formed from the same material as the gate wiring islocated below and overlapped with the second terminal 150, which iselectrically connected to the source wiring, with the gate insulatinglayer 102 interposed therebetween. The electrode 156 is not electricallyconnected to the second terminal 150. When the electrode 156 is set to,for example, floating, GND, or 0 V such that the potential of theelectrode 156 is different from the potential of the second terminal150, a capacitor for preventing noise or static electricity can beformed. In addition, the second terminal 150 is electrically connectedto the transparent conductive film 155 with the protective insulatingfilm 154 interposed therebetween.

A plurality of gate wirings, source wirings, and capacitor wirings areprovided depending on the pixel density. Also in the terminal portion,the first terminal at the same potential as the gate wiring, the secondterminal at the same potential as the source wiring, the third terminalat the same potential as the capacitor wiring, and the like are eacharranged in plurality. There is no particular limitation on the numberof each of the terminals, and the number of the terminals may bedetermined by a practitioner as appropriate.

By these six photolithography steps, using six photomasks, a pixel thinfilm transistor portion including the thin film transistor 170 that is abottom-gate n-channel thin film transistor, and a storage capacitor canbe completed. These are arranged in matrix in respective pixels so thata pixel portion is formed, which can be used as one of substrates formanufacturing an active matrix display. In this specification, such asubstrate is referred to as an active matrix substrate for convenience.

When an active matrix liquid crystal display device is manufactured, anactive matrix substrate and a counter substrate provided with a counterelectrode are bonded to each other with a liquid crystal layerinterposed therebetween. Note that a common electrode electricallyconnected to the counter electrode on the counter substrate is providedover the active matrix substrate, and a fourth terminal electricallyconnected to the common electrode is provided in the terminal portion.This fourth terminal is provided so that the common electrode is fixedto a predetermined potential such as GND or 0 V.

Further, this embodiment is not limited to a pixel structure in FIG. 7,and an example of a plan view different from FIG. 7 is illustrated inFIG. 9. FIG. 9 illustrates an example in which a capacitor wiring is notprovided and a storage capacitor is formed with a pixel electrode and agate wiring of an adjacent pixel which overlap each other with aprotective insulating film and a gate insulating layer interposedtherebetween. In this case, the capacitor wiring and the third terminalconnected to the capacitor wiring can be omitted. Note that in FIG. 9,the same portions as those in FIG. 7 are denoted by the same referencenumerals.

In an active matrix liquid crystal display device, display patterns areformed on a screen by driving of pixel electrodes that are arranged inmatrix. Specifically, voltage is applied between a selected pixelelectrode and a counter electrode corresponding to the pixel electrode,and thus, a liquid crystal layer disposed between the pixel electrodeand the counter electrode is optically modulated. This opticalmodulation is recognized as a display pattern by a viewer.

A liquid crystal display device has a problem in that, when displaying amoving image, image sticking occurs or the moving image is blurredbecause the response speed of liquid crystal molecules themselves islow. As a technique for improving moving image characteristics of aliquid crystal display device, there is a driving technique which isso-called black insertion by which an entirely black image is displayedevery other frame.

Further, there is another driving technique which is so-calleddouble-frame rate driving. In the double-frame rate driving, a normalvertical synchronizing frequency is set 1.5 times or more or 2 times ormore, whereby moving image characteristics are improved.

Furthermore, as a technique for improving moving image characteristicsof a liquid crystal display device, there is another driving techniquein which, as a backlight, a surface light source including a pluralityof LED (light-emitting diode) light sources or a plurality of EL lightsources is used, and each light source included in the surface lightsource is independently driven so as to perform intermittent lightningin one frame period. As the surface light source, three or more kinds ofLEDs may be used, or a white-light-emitting LED may be used. Since aplurality of LEDs can be controlled independently, the timing at whichthe LEDs emit light can be synchronized with the timing at which opticalmodulation of a liquid crystal layer is switched. In this drivingtechnique, part of LEDs can be turned off. Therefore, especially in thecase of displaying an image in which the proportion of a black imagearea in one screen is high, a liquid crystal display device can bedriven with low power consumption.

When combined with any of these driving techniques, a liquid crystaldisplay device can have better display characteristics such as movingimage characteristics than conventional liquid crystal display devices.

The n-channel transistor obtained in this embodiment includes anIn—Ga—Zn—O-based non-single-crystal film as a channel formation regionand has excellent dynamic characteristics; thus, it can be combined withthese driving techniques.

In the case of manufacturing a light-emitting display device, oneelectrode (also called a cathode) of an organic light-emitting elementis set at a low power supply potential such as GND or 0 V; thus, afourth terminal for setting the cathode at a low power supply potentialsuch as GND or 0 V is provided in a terminal portion. In addition, inthe case of manufacturing a light-emitting display device, besides asource wiring and a gate wiring, a power supply line is provided.Accordingly, a fifth terminal which is electrically connected to thepower supply line is provided in a terminal portion.

As described above, in a thin film transistor using an oxidesemiconductor layer, a semiconductor layer having higher electricalconductivity and a smaller thickness than the oxide semiconductor layeris formed between the oxide semiconductor layer and a gate insulatinglayer, whereby field effect mobility of the thin film transistor can beimproved. In addition, increase in off current can be suppressed even inthe thin film transistor with improved field effect mobility.

By using the thin film transistor for a pixel portion and a drivercircuit portion of a display device, the display device with highelectrical characteristics and high reliability can be provided.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 3

In this embodiment, a thin film transistor having a different structurethan that of the thin film transistor described in Embodiment 1 isdescribed with reference to FIG. 10.

A thin film transistor having a bottom gate structure of this embodimentis illustrated in FIG. 10. In the thin film transistor illustrated inFIG. 10, the gate electrode layer 101 is provided over the substrate100; the gate insulating layer 102 provided over the gate electrodelayer 101; the semiconductor layer 106 is provided over the gateinsulating layer 102; the oxide semiconductor layer 103 is provided overthe semiconductor layer 106; buffer layers 301 a and 301 b are providedover the oxide semiconductor layer 103; and the source and drainelectrode layers 105 a and 105 b are provided over the buffer layers 301a and 301 b. The source or drain electrode layer 105 a has a three-layerstructure of the first conductive layer 112 a, the second conductivelayer 113 a, and the third conductive layer 114 a while the source ordrain electrode layer 105 b has a three-layer structure of the firstconductive layer 112 b, the second conductive layer 113 b, and the thirdconductive layer 114 b. That is, the thin film transistor illustrated inFIG. 10 has a structure in which the buffer layers 301 a and 301 b areprovided between the oxide semiconductor layer 103 and the source anddrain electrode layers 105 a and 105 b in the thin film transistorillustrated in FIGS. 1A and 1B in Embodiment 1.

In a manner similar to formation of the oxide semiconductor layer 103,the buffer layers 301 a and 301 b serving as a source and drain regionsare formed using an In—Ga—Zn—O-based non-single-crystal film which is anoxide semiconductor film containing In, Ga, and Zn. Note that the bufferlayers 301 a and 301 b have n-type conductivity and higher electricalconductivity than the oxide semiconductor layer 103. The electricalconductivity of the buffer layers 301 a and 301 b is approximately equalto or higher than that of the semiconductor layer 106. Further, thebuffer layers 301 a and 301 b are In—Ga—Zn—O-based non-single-crystalfilms, and include at least an amorphous component. In addition, thebuffer layers 301 a and 301 b include crystal grains (nanocrystals) inthe amorphous structure in some cases. The crystal grains (nanocrystals)each have a diameter of 1 nm to 10 nm, typically, about 2 nm to 4 nm.

The In—Ga—Zn—O-based non-single-crystal film used for the buffer layers301 a and 301 b is formed by a sputtering method. As specificconditions, an oxide semiconductor target containing In, Ga, and Zn(In₂O₃:Ga₂O₃:ZnO=1:1:1) of 8 inches in diameter is used, the distancebetween the substrate and the target is set to 170 mm, a flow rate ratioof Ar to O₂ is 50 to 1 (sccm), and film formation is performed bysputtering at a pressure of 0.4 Pa, with a direct-current (DC) powersource of 0.5 kW, and at room temperature.

Note that the conditions of forming the In—Ga—Zn—O-basednon-single-crystal film used for the buffer layers 301 a and 301 b aredifferent from those of forming the In—Ga—Zn—O-based non-single-crystalfilm used for the oxide semiconductor layer or the semiconductor layer.For example, the proportion of the flow rate of the oxygen gas in thefilm-forming gas for forming the In—Ga—Zn—O-based non-single-crystalfilm used for the buffer layers 301 a and 301 b is made lower than thatof the flow rate of the oxygen gas to the film-forming gas for formingthe In—Ga—Zn—O-based non-single-crystal film used for the oxidesemiconductor layer. In addition, the proportion of the flow rate of theoxygen gas in the film-forming gas for forming the In—Ga—Zn—O-basednon-single-crystal film used for the buffer layers 301 a and 301 b ismade approximately equal to or lower than that of the flow rate of theoxygen gas to the film-forming gas for forming the In—Ga—Zn—O-basednon-single-crystal film used for the semiconductor layer. Further, theIn—Ga—Zn—O-based non-single-crystal film used for the buffer layers 301a and 301 b may be formed in an atmosphere of rare gas such as an argongas without containing an oxygen gas.

The thickness of the In—Ga—Zn—O-based non-single-crystal film used forthe buffer layers 301 a and 301 b is set to 5 nm to 20 nm. Needless tosay, when the film includes crystal grains, the size of the crystalgrains does not exceed the thickness of the film. In this embodiment,the thickness of the In—Ga—Zn—O-based non-single-crystal film used forthe buffer layers 301 a and 301 b is set to 5 nm.

The buffer layers 301 a and 301 b may contain an impurity elementimparting n-type conductivity. As an example of the impurity element, itis possible to use, for example, magnesium, aluminum, titanium, iron,tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron,thallium, or lead. In the case where magnesium, aluminum, titanium, orthe like is contained in the buffer layers, there is an effect ofblocking oxygen, and the like, so that the oxygen concentration of theoxide semiconductor layer can be maintained within an optimal range byheat treatment or the like after film formation.

The carrier concentration of the buffer layers is preferably 1×10¹⁸/cm³or higher (and 1×10²²/cm³ or lower).

As described above, provision of the buffer layers 301 a and 301 b canmake thermal stability improved more than formation of Schottky junctiondo, between the oxide semiconductor layer and the semiconductor layerand the source and drain electrode layers, whereby operatingcharacteristics of the thin film transistor can be stabilized. Inaddition, because of high electrical conductivity, favorable mobilitycan be ensured even when high drain voltage is applied.

Note that, as for a structure and materials of the thin film transistorof this embodiment other than the buffer layers 301 a and 301 b,Embodiment 1 is to be referred to.

A manufacturing process of the thin film transistor of this embodimentis almost similar to the manufacturing process of the thin filmtransistor described in Embodiment 2. First, by the method described inEmbodiment 2, steps up to forming the second oxide semiconductor filmfor forming the oxide semiconductor layer 103 are performed. Followingthe above steps, the oxide semiconductor film for forming the bufferlayers 301 a and 301 b is formed by sputtering with use of the abovemethod. Next, by a second photolithography step, in a manner similar toformation of the semiconductor layer 106 and the oxide semiconductorfilm 111, the oxide semiconductor film for forming the buffer layers 301a and 301 b is etched into an island shape, whereby an oxidesemiconductor film 302 is formed (see FIG. 11A). Then, by the methoddescribed in Embodiment 2, steps up to forming the first conductivelayer 112, the second conductive layer 113, and the third conductivelayer 114 are performed (see FIG. 11B). Next, by a fourthphotolithography step, in a manner similar to formation of the sourceand drain electrode layers 105 a and 105 b and the oxide semiconductorlayer 103, the oxide semiconductor film 302 is etched to form the bufferlayers 301 a and 301 b (see FIG. 11C). Subsequent steps are similar tothose in Embodiment 2.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 4

In this embodiment, an example will be described below, in which atleast part of a driver circuit and a thin film transistor arranged in apixel portion are formed over the same substrate in a display devicewhich is one example of a semiconductor device.

The thin film transistor to be arranged in the pixel portion is formedaccording to Embodiment 2. Further, the thin film transistor describedin Embodiment 2 is an n-channel TFT, and thus part of a driver circuitthat can include an n-channel TFT among driver circuits is formed overthe same substrate as the thin film transistor of the pixel portion.

FIG. 14A illustrates an example of a block diagram of an active matrixliquid crystal display device which is an example of a semiconductordevice. The display device illustrated in FIG. 14A includes, over asubstrate 5300, a pixel portion 5301 including a plurality of pixelsthat are each provided with a display element; a scan line drivercircuit 5302 that selects a pixel; and a signal line driver circuit 5303that controls a video signal input to the selected pixel.

The pixel portion 5301 is connected to the signal line driver circuit5303 by a plurality of signal lines S1 to Sm (not illustrated) thatextend in a column direction from the signal line driver circuit 5303,and to the scan line driver circuit 5302 by a plurality of scan lines G1to Gn (not illustrated) that extend in a row direction from the scanline driver circuit 5302. The pixel portion 5301 includes a plurality ofpixels (not illustrated) arranged in matrix so as to correspond to thesignal lines Si to Sm and the scan lines G1 to Gn. Each pixel isconnected to a signal line Sj (one of the signal lines S1 to Sm) and ascan line Gj (one of the scan lines G1 to Gn).

In addition, the thin film transistor described in each of Embodiments 1to 3 is an n-channel TFT, and a signal line driver circuit including then-channel TFT is described with reference to FIG. 15.

The signal line driver circuit illustrated in FIG. 15 includes a driverIC 5601, switch groups 5602_1 to 5602_M, a first wiring 5611, a secondwiring 5612, a third wiring 5613, and wirings 5621_1 to 5621_M. Each ofthe switch groups 5602_1 to 5602_M includes a first thin film transistor5603 a, a second thin film transistor 5603 b, and a third thin filmtransistor 5603 c.

The driver IC 5601 is connected to the first wiring 5611, the secondwiring 5612, the third wiring 5613, and the wirings 5621_1 to 5621_M.Each of the switch groups 5602_1 to 5602_M is connected to the firstwiring 5611, the second wiring 5612, and the third wiring 5613, and thewirings 5621_1 to 5621_M are connected to the switch groups 5602_1 to5602_M, respectively. Each of the wirings 5621_1 to 5621_M is connectedto three signal lines (a signal line Sm−2, a signal line Sm−1, and asignal line Sm (m=3M)) via the first thin film transistor 5603 a, thesecond thin film transistor 5603 b, and the third thin film transistor5603 c. For example, the wiring 5621_J of the J-th column (one of thewirings 5621_1 to 5621_M) is connected to a signal line Sj−2, a signalline Sj−1, and a signal line Sj (j=3J) via the first thin filmtransistor 5603 a, the second thin film transistor 5603 b, and the thirdthin film transistor 5603 c which are included in the switch group5602_J.

A signal is input to each of the first wiring 5611, the second wiring5612, and the third wiring 5613.

Note that the driver IC 5601 is preferably formed using a single crystalsemiconductor. The switch groups 5602_1 to 5602_M are preferably formedover the same substrate as the pixel portion is. Therefore, the driverIC 5601 and the switch groups 5602_1 to 5602_M are preferably connectedthrough an FPC or the like. Alternatively, the driver IC 5601 may beformed by providing a single crystal semiconductor layer over the samesubstrate as the pixel portion is by a method such as bonding.

Next, operation of the signal line driver circuit illustrated in FIG. 15is described with reference to a timing chart in FIG. 16. The timingchart in FIG. 16 illustrates a case where the scan line Gi of the i-throw is selected. A selection period of the scan line Gi of the i-th rowis divided into a first sub-selection period T1, a second sub-selectionperiod T2, and a third sub-selection period T3. In addition, the signalline driver circuit in FIG. 15 operates similarly to that in FIG. 16even when a scan line of another row is selected.

Note that the timing chart in FIG. 16 shows a case where the wiring5621_J of the J-th column is connected to the signal line Sj−2, thesignal line Sj−1, and the signal line Sj via the first thin filmtransistor 5603 a, the second thin film transistor 5603 b, and the thirdthin film transistor 5603 c.

The timing chart in FIG. 16 shows timing at which the scan line Gi ofthe i-th row is selected, timing 5703 a of on/off of the first thin filmtransistor 5603 a, timing 5703 b of on/off of the second thin filmtransistor 5603 b, timing 5703 c of on/off of the third thin filmtransistor 5603 c, and a signal 5721_J input to the wiring 5621_J of theJ-th column.

In the first sub-selection period T1, the second sub-selection periodT2, and the third sub-selection period T3, different video signals areinput to the wirings 5621_1 to 5621_M. For example, a video signal inputto the wiring 5621_J in the first sub-selection period T1 is input tothe signal line Sj−2, a video signal input to the wiring 5621_J in thesecond sub-selection period T2 is input to the signal line Sj−1, and avideo signal input to the wiring 5621_J in the third sub-selectionperiod T3 is input to the signal line Sj. In addition, the video signalsinput to the wiring 5621_J in the first sub-selection period T1, thesecond sub-selection period T2, and the third sub-selection period T3are denoted by Data_j−2, Data_j−1, and Data_j.

As illustrated in FIG. 16, in the first sub-selection period T1, thefirst thin film transistor 5603 a is turned on, and the second thin filmtransistor 5603 b and the third thin film transistor 5603 c are turnedoff. At this time, Data_j−2 input to the wiring 5621_J is input to thesignal line Sj−2 via the first thin film transistor 5603 a. In thesecond sub-selection period T2, the second thin film transistor 5603 bis turned on, and the first thin film transistor 5603 a and the thirdthin film transistor 5603 c are turned off. At this time, Data_j−1 inputto the wiring 5621_J is input to the signal line Sj−1 via the secondthin film transistor 5603 b. In the third sub-selection period T3, thethird thin film transistor 5603 c is turned on, and the first thin filmtransistor 5603 a and the second thin film transistor 5603 b are turnedoff. At this time, Data_j input to the wiring 5621_J is input to thesignal line Sj via the third thin film transistor 5603 c.

As described above, in the signal line driver circuit in FIG. 15, bydividing one gate selection period into three, video signals can beinput to three signal lines from one wiring 5621 in one gate selectionperiod. Therefore, in the signal line driver circuit in FIG. 15, thenumber of connections between the substrate provided with the driver IC5601 and the substrate provided with the pixel portion can beapproximately ⅓ of the number of signal lines. The number of connectionsis reduced to approximately ⅓ of the number of the signal lines, so thatreliability, yield, etc., of the signal line driver circuit in FIG. 15can be improved.

Note that there are no particular limitations on the arrangement, thenumber, a driving method, and the like of the thin film transistors, aslong as one gate selection period is divided into a plurality ofsub-selection periods and video signals are input to a plurality ofsignal lines from one wiring in the respective sub-selection periods asillustrated in FIG. 15.

For example, when video signals are input to three or more signal linesfrom one wiring in each of three or more sub-selection periods, it isonly necessary to add a thin film transistor and a wiring forcontrolling the thin film transistor. Note that when one gate selectionperiod is divided into four or more sub-selection periods, onesub-selection period becomes short. Therefore, one gate selection periodis preferably divided into two or three sub-selection periods.

As another example, one gate selection period may be divided into aprecharge period Tp, the first sub-selection period T1, the secondsub-selection period T2, and the third sub-selection period T3 asillustrated in a timing chart in FIG. 17. The timing chart in FIG. 17illustrates timing at which the scan line Gi of the i-th row isselected, timing 5803 a of on/off of the first thin film transistor 5603a, timing 5803 b of on/off of the second thin film transistor 5603 b,timing 5803 c of on/off of the third thin film transistor 5603 c, and asignal 5821_J input to the wiring 5621_J of the J-th column. Asillustrated in FIG. 17, the first thin film transistor 5603 a, thesecond thin film transistor 5603 b, and the third thin film transistor5603 c are turned on in the precharge period Tp. At this time, prechargevoltage Vp input to the wiring 5621_J is input to each of the signalline Sj−2, the signal line Sj−1, and the signal line Sj via the firstthin film transistor 5603 a, the second thin film transistor 5603 b, andthe third thin film transistor 5603 c. In the first sub-selection periodT1, the first thin film transistor 5603 a is turned on, and the secondthin film transistor 5603 b and the third thin film transistor 5603 care turned off. At this time, Data_j−2 input to the wiring 5621_J isinput to the signal line Sj−2 via the first thin film transistor 5603 a.In the second sub-selection period T2, the second thin film transistor5603 b is turned on, and the first thin film transistor 5603 a and thethird thin film transistor 5603 c are turned off. At this time, Data_j−1input to the wiring 5621_J is input to the signal line Sj−1 via thesecond thin film transistor 5603 b. In the third sub-selection periodT3, the third thin film transistor 5603 c is turned on, and the firstthin film transistor 5603 a and the second thin film transistor 5603 bare turned off. At this time, Data_j input to the wiring 5621_J is inputto the signal line Sj via the third thin film transistor 5603 c.

As described above, in the signal line driver circuit in FIG. 15 towhich the timing chart in FIG. 17 is applied, the video signal can bewritten to the pixel at high speed because the signal line can beprecharged by providing a precharge selection period before asub-selection period. Note that portions in FIG. 17 which are similar tothose of FIG. 16 are denoted by common reference numerals and detaileddescription of the same portions and portions which have similarfunctions is omitted.

Further, a structure of a scan line driver circuit is described. Thescan line driver circuit includes a shift register and a buffer.Additionally, the scan line driver circuit may include a level shifterin some cases. In the scan line driver circuit, when the clock signal(CLK) and the start pulse signal (SP) are input to the shift register, aselection signal is produced. The selection signal produced is bufferedand amplified by the buffer, and the resulting signal is supplied to acorresponding scan line. Gate electrodes of transistors in pixels of oneline are connected to the scan line. Further, since the transistors inthe pixels of one line have to be turned on at the same time, a bufferwhich can feed a large amount of current is used.

One mode of a shift register which is used for part of a scan linedriver circuit is described with reference to FIG. 18 and FIG. 19.

FIG. 18 illustrates a circuit configuration of the shift register. Theshift register illustrated in FIG. 18 includes a plurality offlip-flops, flip-flops 5701_1 to 5701_n. The shift register is operatedwith input of a first clock signal, a second clock signal, a start pulsesignal, and a reset signal.

The connection relation of the shift register illustrated in FIG. 18 isdescribed. The flip-flop 5701_1 of a first stage is connected to a firstwiring 5711, a second wiring 5712, a fourth wiring 5714, a fifth wiring5715, a seventh wiring 5717_1, and a seventh wiring 5717_2. Theflip-flop 5717_2 of a second stage is connected to a third wiring 5713,the fourth wiring 5714, the fifth wiring 5715, the seventh wiring5717_1, the seventh wiring 5717_2, and a seventh wiring 5717_3.

In a similar manner, the flip-flop 5701_i (any one of the flip-flops5701_1 to 5701_n) of an i-th stage is connected to one of the secondwiring 5712 and the third wiring 5713, the fourth wiring 5714, the fifthwiring 5715, a seventh wiring 5717_i−1, a seventh wiring 5717_i, and aseventh wiring 5717_i+1. Here, when the “i” is an odd number, theflip-flop 5701_i of the i-th stage is connected to the second wiring5712; when the “i” is an even number, the flip-flop 5701_i of the i-thstage is connected to the third wiring 5713.

The flip-flop 5701_n of an n-th stage is connected to one of the secondwiring 5712 and the third wiring 5713, the fourth wiring 5714, the fifthwiring 5715, a seventh wiring 5717_n−1, the seventh wiring 5717_n, and asixth wiring 5716.

Note that the first wiring 5711, the second wiring 5712, the thirdwiring 5713, and the sixth wiring 5716 may be referred to as a firstsignal line, a second signal line, a third signal line, and a fourthsignal line, respectively. The fourth wiring 5714 and the fifth wiring5715 may be referred to as a first power supply line and a second powersupply line, respectively.

Next, FIG. 19 illustrates details of the flip-flop illustrated in FIG.18. A flip-flop illustrated in FIG. 19 includes a first thin filmtransistor 5571, a second thin film transistor 5572, a third thin filmtransistor 5573, a fourth thin film transistor 5574, a fifth thin filmtransistor 5575, a sixth thin film transistor 5576, a seventh thin filmtransistor 5577, and an eighth thin film transistor 5578. Each of thefirst thin film transistor 5571, the second thin film transistor 5572,the third thin film transistor 5573, the fourth thin film transistor5574, the fifth thin film transistor 5575, the sixth thin filmtransistor 5576, the seventh thin film transistor 5577, and the eighththin film transistor 5578 is an n-channel transistor and is turned onwhen the gate-source voltage (V_(gs)) exceeds the threshold voltage(V_(th)).

In addition, the flip-flop illustrated in FIG. 19 includes a firstwiring 5501, a second wiring 5502, a third wiring 5503, a fourth wiring5504, a fifth wiring 5505, and a sixth wiring 5506.

Note that all thin film transistors here are enhancement-mode n-channeltransistors; however, the present invention is not limited thereto. Forexample, the driver circuit can be operated using depression-moden-channel transistors.

Next, connections of the flip-flop illustrated in FIG. 18 are describedbelow.

A first electrode (one of a source electrode and a drain electrode) ofthe first thin film transistor 5571 is connected to the fourth wiring5504. A second electrode (the other of the source electrode and thedrain electrode) of the first thin film transistor 5571 is connected tothe third wiring 5503.

A first electrode of the second thin film transistor 5572 is connectedto the sixth wiring 5506. A second electrode of the second thin filmtransistor 5572 is connected to the third wiring 5503.

A first electrode of the third thin film transistor 5573 is connected tothe fifth wiring 5505. A second electrode of the third thin filmtransistor 5573 is connected to a gate electrode of the second thin filmtransistor 5572. A gate electrode of the third thin film transistor 5573is connected to the fifth wiring 5505.

A first electrode of the fourth thin film transistor 5574 is connectedto the sixth wiring 5506. A second electrode of the fourth thin filmtransistor 5574 is connected to the gate electrode of the second thinfilm transistor 5572. A gate electrode of the fourth thin filmtransistor 5574 is connected to a gate electrode of the first thin filmtransistor 5571.

A first electrode of the fifth thin film transistor 5575 is connected tothe fifth wiring 5505. A second electrode of the fifth thin filmtransistor 5575 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the fifth thin film transistor5575 is connected to the first wiring 5501.

A first electrode of the sixth thin film transistor 5576 is connected tothe sixth wiring 5506. A second electrode of the sixth thin filmtransistor 5576 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the sixth thin film transistor5576 is connected to the gate electrode of the second thin filmtransistor 5572.

A first electrode of the seventh thin film transistor 5577 is connectedto the sixth wiring 5506. A second electrode of the seventh thin filmtransistor 5577 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the seventh thin filmtransistor 5577 is connected to the second wiring 5502. A firstelectrode of the eighth thin film transistor 5578 is connected to thesixth wiring 5506. A second electrode of the eighth thin film transistor5578 is connected to the gate electrode of the second thin filmtransistor 5572. A gate electrode of the eighth thin film transistor5578 is connected to the first wiring 5501.

Note that the points at which the gate electrode of the first thin filmtransistor 5571, the gate electrode of the fourth thin film transistor5574, the second electrode of the fifth thin film transistor 5575, thesecond electrode of the sixth thin film transistor 5576, and the secondelectrode of the seventh thin film transistor 5577 are connected areeach referred to as a node 5543. The points at which the gate electrodeof the second thin film transistor 5572, the second electrode of thethird thin film transistor 5573, the second electrode of the fourth thinfilm transistor 5574, the gate electrode of the sixth thin filmtransistor 5576, and the second electrode of the eighth thin filmtransistor 5578 are connected are each referred to as a node 5544.

Note that the first wiring 5501, the second wiring 5502, the thirdwiring 5503, and the fourth wiring 5504 may be referred to as a firstsignal line, a second signal line, a third signal line, and a fourthsignal line, respectively. The fifth wiring 5505 and the sixth wiring5506 may be referred to as a first power supply line and a second powersupply line, respectively.

In the flip-flop 5701_i of the i-th stage, the first wiring 5501 in FIG.19 is connected to the seventh wiring 5717_i−1 in FIG. 18. The secondwiring 5502 in FIG. 19 is connected to the seventh wiring 5717_i+1 inFIG. 18. The third wiring 5503 in FIG. 19 is connected to the seventhwiring 5717_i. The sixth wiring 5506 in FIG. 19 is connected to thefifth wiring 5715.

If the “i” is an odd number, the fourth wiring 5504 in FIG. 19 isconnected to the second wiring 5712 in FIG. 18; if the “i” is an evennumber, the fourth wiring 5504 in FIG. 19 is connected to the thirdwiring 5713 in FIG. 18. In addition, the fifth wiring 5505 in FIG. 19 isconnected to the fourth wiring 5714 in FIG. 18.

Note that in the flip-flop 5701_1 of the first stage, the first wiring5501 in FIG. 19 is connected to the first wiring 5711 in FIG. 18. Inaddition, in the flip-flop 5701_n of the n-th stage, the second wiring5502 in FIG. 19 is connected to the sixth wiring 5716 in FIG. 18.

In addition, the signal line driver circuit and the scan line drivercircuit can be formed using only the n-channel TFTs described in any ofEmbodiments 1 to 3. The n-channel TFT described in any of Embodiments 1to 3 has high mobility, and thus a driving frequency of a driver circuitcan be increased. Further, parasitic capacitance is reduced by thesource or drain region which is an In—Ga—Zn—O-based non-single-crystalfilm; thus, the n-channel TFT described in any of Embodiments 1 to 3 hashigh frequency characteristics (referred to as f characteristics). Forexample, a scan line driver circuit using the n-channel TFT described inany of Embodiments 1 to 3 can operate at high speed, and thus a framefrequency can be increased and insertion of black images can berealized.

In addition, when the channel width of the transistor in the scan linedriver circuit is increased or a plurality of scan line driver circuitsare provided, for example, higher frame frequency can be realized. Whena plurality of scan line driver circuits are provided, a scan linedriver circuit for driving scan lines of even-numbered rows is providedon one side and a scan line driver circuit for driving scan lines ofodd-numbered rows is provided on the opposite side; thus, increase inframe frequency can be realized. Furthermore, the use of the pluralityof scan line driver circuits for output of signals to the same scan lineis advantageous in increasing the size of a display device.

Further, when an active matrix light-emitting display device which is anexample of a semiconductor device is manufactured, a plurality of thinfilm transistors are arranged in at least one pixel, and thus aplurality of scan line driver circuits are preferably arranged. FIG. 14Bis a block diagram illustrating an example of an active matrixlight-emitting display device.

The light-emitting display device illustrated in FIG. 14B includes, overa substrate 5400, a pixel portion 5401 having a plurality of pixels eachprovided with a display element, a first scan line driver circuit 5402and a second scan line driver circuit 5404 that select a pixel, and asignal line driver circuit 5403 that controls input of a video signal tothe selected pixel.

When the video signal input to a pixel of the light-emitting displaydevice illustrated in FIG. 14B is a digital signal, a pixel is in alight-emitting state or in a non-light-emitting state by switching ofON/OFF of a transistor. Thus, grayscale can be displayed using an arearatio grayscale method or a time ratio grayscale method. An area ratiograyscale method refers to a driving method by which one pixel isdivided into a plurality of subpixels and the respective subpixels aredriven independently based on video signals so that grayscale isdisplayed. A time ratio grayscale method refers to a driving method bywhich a period during which a pixel is in a light-emitting state iscontrolled so that grayscale is displayed.

Since the response speed of light-emitting elements is higher than thatof liquid crystal elements or the like, the light-emitting elements aremore suitable for a time ratio grayscale method than liquid-crystaldisplay elements. Specifically, in the case of displaying with a timegray scale method, one frame period is divided into a plurality ofsubframe periods. Then, in accordance with video signals, thelight-emitting element in the pixel is set in a light-emitting state orin a non-light-emitting state during each subframe period. By dividingone frame into a plurality of subframes, the total length of time, inwhich pixels actually emit light in one frame period, can be controlledwith video signals so that gray scales are displayed.

In the example of the light-emitting display device illustrated in FIG.14B, in a case where two switching TFTs are arranged in one pixel, thefirst scan line driver circuit 5402 generates a signal which is input toa first scan line serving as a gate wiring of one of the switching TFTs,and the second scan line driver circuit 5404 generates a signal which isinput to a second scan line serving as a gate wiring of the other of theswitching TFTs; however, one scan line driver circuit may generate boththe signal which is input to the first scan line and the signal which isinput to the second scan line. In addition, for example, there is apossibility that a plurality of scan lines used for controlling theoperation of the switching elements be provided in each pixel dependingon the number of switching TFTs included in one pixel. In that case, onescan line driver circuit may generate all signals that are input to theplurality of scan lines, or a plurality of scan line driver circuits maygenerate signals that are input to the plurality of scan lines.

In addition, also in the light-emitting display device, part of thedriver circuit that can include n-channel TFTs among driver circuits canbe formed over the same substrate as the thin film transistors of thepixel portion. Alternatively, the signal line driver circuit and thescan line driver circuit can be formed using only the n-channel TFTsdescribed in Embodiment 2.

Moreover, the above-described driver circuit can be used for electronicpaper that drives electronic ink using an element electrically connectedto a switching element, without being limited to applications to aliquid crystal display device or a light-emitting display device. Theelectronic paper is also referred to as an electrophoretic displaydevice (electrophoretic display) and has advantages in that it has thesame level of readability as plain paper, it has lower power consumptionthan other display devices, and it can be made thin and lightweight.

Electrophoretic displays can have various modes. Electrophoreticdisplays contain a plurality of microcapsules dispersed in a solvent ora solute, each microcapsule containing first particles which arepositively charged and second particles which are negatively charged. Byapplying an electric field to the microcapsules, the particles in themicrocapsules are moved in opposite directions to each other and onlythe color of the particles concentrated on one side is exhibited. Notethat the first particles and the second particles each contain pigmentand do not move without an electric field. Moreover, the colors of thefirst particles and the second particles are different from each other(the colors include colorless or achroma).

In this way, an electrophoretic display is a display that utilizes aso-called dielectrophoretic effect by which a substance that has a highdielectric constant moves to a high-electric field region.

A solution in which the aforementioned microcapsules are dispersedthroughout a solvent is referred to as electronic ink. This electronicink can be printed on a surface of glass, plastic, cloth, paper, or thelike. Furthermore, by use of a color filter or particles that have apigment, color display is possible, as well.

In addition, if a plurality of the aforementioned microcapsules arearranged as appropriate over an active matrix substrate so as to beinterposed between two electrodes, an active matrix display device canbe completed, and display can be performed by application of an electricfield to the microcapsules. For example, the active matrix substrateobtained with the thin film transistor described in Embodiment 2 can beused.

Note that the first particles and the second particles in themicrocapsules may each be formed of a single material selected from aconductive material, an insulating material, a semiconductor material, amagnetic material, a liquid crystal material, a ferroelectric material,an electroluminescent material, an electrochromic material, or amagnetophoretic material or formed of a composite material of any ofthese.

Through the above steps, a highly reliable display device as asemiconductor device can be manufactured.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 5

The thin film transistor described in any of Embodiments 1 to 3 ismanufactured, and a semiconductor device having a display function (alsoreferred to as a display device) can be manufactured using the thin filmtransistor in a pixel portion and further in a driver circuit. Further,part or whole of a driver circuit can be formed over the same substrateas a pixel portion, using the thin film transistor described in any ofEmbodiments 1 to 3, whereby a system-on-panel can be obtained.

The display device includes a display element. As the display element, aliquid crystal element (also referred to as a liquid crystal displayelement) or a light-emitting element (also referred to as alight-emitting display element) can be used. Light-emitting elementsinclude, in its category, an element whose luminance is controlled bycurrent or voltage, and specifically include an inorganicelectroluminescent (EL) element, an organic EL element, and the like.Further, a display medium whose contrast is changed by an electriceffect, such as an electronic ink, can be used.

In addition, the display device includes a panel in which the displayelement is sealed, and a module in which an IC including a controller orthe like is mounted on the panel. An embodiment of the present inventionrelates to one embodiment of an element substrate before the displayelement is completed in a manufacturing process of the display device,and the element substrate is provided with means for supplying currentto the display element in each of a plurality of pixels. Specifically,the element substrate may be in a state provided with only a pixelelectrode of the display element, a state after a conductive film to bea pixel electrode is formed and before the conductive film is etched toform the pixel electrode, or any of other states.

Note that a display device in this specification means an image displaydevice, a display device, or a light source (including a lightingdevice). Further, the display device includes any of the followingmodules in its category: a module to which a connector such as aflexible printed circuit (FPC), tape automated bonding (TAB) tape, or atape carrier package (TCP) is attached; a module having TAB tape or aTCP which is provided with a printed wiring board at the end thereof;and a module having an integrated circuit (IC) which is directly mountedon a display element by a chip on glass (COG) method.

In this embodiment, the appearance and a cross section of a liquidcrystal display panel, which is one embodiment of a semiconductordevice, will be described with reference to FIGS. 22A-1 to 22B. FIGS.22A-1 and 22A-2 are top views of a panel in which highly reliable thinfilm transistors 4010 and 4011 each including the In—Ga—Zn—O-basednon-single-crystal film described in any of Embodiments 1 to 3 as anoxide semiconductor layer, and a liquid crystal element 4013 formed overa first substrate 4001 are sealed between the first substrate 4001 and asecond substrate 4006 with a sealant 4005. FIG. 22B is a cross-sectionalview taken along line M-N of FIGS. 22A-1 and 22A-2.

The sealant 4005 is provided so as to surround a pixel portion 4002 anda scan line driver circuit 4004 which are provided over the firstsubstrate 4001. The second substrate 4006 is provided over the pixelportion 4002 and the scan line driver circuit 4004. Therefore, the pixelportion 4002 and the scan line driver circuit 4004 are sealed togetherwith a liquid crystal layer 4008, by the first substrate 4001, thesealant 4005, and the second substrate 4006. A signal line drivercircuit 4003 that is formed using a single crystal semiconductor film ora polycrystalline semiconductor film over a substrate separatelyprepared is mounted in a region that is different from the regionsurrounded by the sealant 4005 over the first substrate 4001.

Note that the connection method of a driver circuit which is separatelyformed is not particularly limited, and a COG method, a wire bondingmethod, a TAB method, or the like can be used. FIG. 22A-1 illustrates anexample of mounting the signal line driver circuit 4003 by a COG method,and FIG. 22A-2 illustrates an example of mounting the signal line drivercircuit 4003 by a TAB method.

The pixel portion 4002 and the scan line driver circuit 4004 providedover the first substrate 4001 include a plurality of thin filmtransistors. FIG. 22B illustrates the thin film transistor 4010 includedin the pixel portion 4002 and the thin film transistor 4011 included inthe scan line driver circuit 4004. Over the thin film transistors 4010and 4011, insulating layers 4020 and 4021 are provided.

The highly reliable thin film transistor including an In—Ga—Zn—O-basednon-single-crystal film as an oxide semiconductor layer, which isdescribed in any of Embodiments 1 to 3, can be applied to each of thethin film transistors 4010 and 4011. In this embodiment, the thin filmtransistors 4010 and 4011 are n-channel thin film transistors.

A pixel electrode layer 4030 included in the liquid crystal element 4013is electrically connected to the thin film transistor 4010. A counterelectrode layer 4031 of the liquid crystal element 4013 is formed on thesecond substrate 4006. A portion where the pixel electrode layer 4030,the counter electrode layer 4031, and the liquid crystal layer 4008overlap one another corresponds to the liquid crystal element 4013. Notethat the pixel electrode layer 4030 and the counter electrode layer 4031are provided with an insulating layer 4032 and an insulating layer 4033respectively which each function as an alignment film, and the liquidcrystal layer 4008 is sandwiched between the pixel electrode layer 4030and the counter electrode layer 4031 with the insulating layers 4032 and4033 interposed therebetween.

Note that the first substrate 4001 and the second substrate 4006 can beformed by using glass, metal (typically, stainless steel), ceramic, orplastic. As plastic, a fiberglass-reinforced plastics (FRP) plate, apolyvinyl fluoride (PVF) film, a polyester film, or an acrylic resinfilm can be used. In addition, a sheet with a structure in which analuminum foil is sandwiched between PVF films or polyester films can beused.

Reference numeral 4035 denotes a columnar spacer obtained by selectivelyetching an insulating film and is provided to control the distancebetween the pixel electrode layer 4030 and the counter electrode layer4031 (a cell gap). Further, a spherical spacer may also be used. Thecounter electrode layer 4031 is electrically connected to a commonpotential line provided over the same substrate as the thin filmtransistor 4010. With the use of the common connection portion, thecounter electrode layer 4031 is electrically connected to the commonpotential line through conductive particles provided between the pair ofsubstrates. Note that the conductive particles are contained in thesealant 4005.

Alternatively, liquid crystal exhibiting a blue phase for which analignment film is unnecessary may be used. A blue phase is one of liquidcrystal phases, which is generated just before a cholesteric phasechanges into an isotropic phase while temperature of cholesteric liquidcrystal is increased. Since the blue phase is generated within an onlynarrow range of temperature, liquid crystal composition containing achiral agent at 5 wt % or more so as to improve the temperature range isused for the liquid crystal layer 4008. The liquid crystal compositionwhich includes liquid crystal exhibiting a blue phase and a chiral agenthave such characteristics that the response time is 10 μs to 100 μs,which is short, the alignment process is unnecessary because the liquidcrystal composition has optical isotropy, and viewing angle dependencyis small.

Although an example of a transmissive liquid crystal display device isdescribed in this embodiment, it can also be applied to a reflectiveliquid crystal display device and a transflective liquid crystal displaydevice.

While an example of the liquid crystal display device in which thepolarizing plate is provided on the outer side of the substrate (on theviewer side) and the coloring layer and the electrode layer used for adisplay element are provided on the inner side of the substrate in thatorder is described in this embodiment, the polarizing plate may beprovided on the inner side of the substrate. The stacked structure ofthe polarizing plate and the coloring layer is not limited to thisembodiment and may be set as appropriate depending on materials of thepolarizing plate and the coloring layer or conditions of manufacturingsteps. Further, a light-blocking film serving as a black matrix may beprovided.

In this embodiment, in order to reduce surface unevenness of the thinfilm transistor and to improve reliability of the thin film transistor,the thin film transistor obtained in any of Embodiments 1 to 3 iscovered with the insulating layers (the insulating layer 4020 and theinsulating layer 4021) functioning as a protective film or a planarizinginsulating film. Note that the protective film is provided to prevententry of contaminant impurities such as an organic substance, a metal,or moisture floating in air and is preferably a dense film. Theprotective film may be formed with a single layer or a stacked layer ofa silicon oxide film, a silicon nitride film, a silicon oxynitride film,a silicon nitride oxide film, an aluminum oxide film, an aluminumnitride film, aluminum oxynitride film, and/or an aluminum nitride oxidefilm by a sputtering method. Although an example in which the protectivefilm is formed by a sputtering method is described in this embodiment,the present invention is not limited to this example, and the protectivefilm may be formed by a variety of methods.

In this embodiment, the insulating layer 4020 having a stacked-layerstructure is formed as a protective film. Here, as a first layer of theinsulating layer 4020, a silicon oxide film is formed by a sputteringmethod. The use of a silicon oxide film as a protective film has aneffect of preventing hillock of an aluminum film used as the source anddrain electrode layers.

As a second layer of the protective film, an insulating layer is formed.In this embodiment, as the second layer of the insulating layer 4020, asilicon nitride film is formed by a sputtering method. The use of thesilicon nitride film as the protective film can prevent mobile ions ofsodium or the like from entering a semiconductor region so thatvariation in electrical characteristics of the TFT can be suppressed.

After the protective film is formed, the oxide semiconductor layer maybe subjected to annealing (300° C. to 400° C.).

The insulating layer 4021 is formed as the planarizing insulating film.As the insulating layer 4021, an organic material having heat resistancesuch as polyimide, acrylic, benzocyclobutene, polyamide, or epoxy can beused. Other than such organic materials, it is also possible to use alow-dielectric constant material (a low-k material), a siloxane-basedresin, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), orthe like. Note that the insulating layer 4021 may be formed by stackinga plurality of insulating films formed of these materials.

Note that a siloxane-based resin is a resin formed from a siloxanematerial as a starting material and having the bond of Si—O—Si. Thesiloxane-based resin may include an organic group (such as an alkylgroup and an aryl group) or a fuoro group as a substituent. The organicgroup may include a fluoro group.

A formation method of the insulating layer 4021 is not particularlylimited, and the following method can be employed depending on thematerial: a sputtering method, an SOG method, a spin coating method, adipping method, a spray coating method, a droplet discharge method(e.g., an ink-jet method, screen printing, offset printing, or thelike), a doctor knife, a roll coater, a curtain coater, a knife coater,or the like. In the case of forming the insulating layer 4021 using amaterial solution, annealing (300° C. to 400° C.) of the oxidesemiconductor layer may be performed at the same time as a baking step.The baking step of the insulating layer 4021 also serves as annealing ofthe oxide semiconductor layer, whereby a semiconductor device can bemanufactured efficiently.

The pixel electrode layer 4030 and the counter electrode layer 4031 canbe formed using a light-transmitting conductive material such as indiumoxide including tungsten oxide, indium zinc oxide including tungstenoxide, indium oxide including titanium oxide, indium tin oxide includingtitanium oxide, indium tin oxide (hereinafter referred to as ITO),indium zinc oxide, indium tin oxide to which silicon oxide is added, orthe like.

A conductive composition including a conductive high molecule (alsoreferred to as a conductive polymer) can be used for the pixel electrodelayer 4030 and the counter electrode layer 4031. The pixel electrodeformed using the conductive composition preferably has a sheetresistance of less than or equal to 10000 ohm/square and a transmittanceof greater than or equal to 70% at a wavelength of 550 nm. Further, theresistivity of the conductive high molecule included in the conductivecomposition is preferably less than or equal to 0.1 Ω·cm.

As the conductive high molecule, a so-called π-electron conjugatedconductive polymer can be used. For example, polyaniline or a derivativethereof, polypyrrole or a derivative thereof, polythiophene or aderivative thereof, a copolymer of two or more kinds of them, and thelike can be given.

Further, a variety of signals and potentials are supplied to the signalline driver circuit 4003 which is formed separately, the scan linedriver circuit 4004, or the pixel portion 4002 from an FPC 4018.

In this embodiment, a connection terminal electrode 4015 is formed fromthe same conductive film as that of the pixel electrode layer 4030included in the liquid crystal element 4013, and a terminal electrode4016 is formed from the same conductive film as that of the source anddrain electrode layers of the thin film transistors 4010 and 4011.

The connection terminal electrode 4015 is electrically connected to aterminal included in the FPC 4018 through an anisotropic conductive film4019.

FIGS. 22A-1 to 22B illustrate an example in which the signal line drivercircuit 4003 is formed separately and mounted on the first substrate4001; however, this embodiment is not limited to this structure. Thescan line driver circuit may be separately formed and then mounted, oronly part of the signal line driver circuit or part of the scan linedriver circuit may be separately formed and then mounted.

FIG. 23 illustrates an example in which a liquid crystal display moduleis formed as a semiconductor device by using a TFT substrate 2600manufactured by application of the TFT described in any of Embodiments 1to 3.

FIG. 23 illustrates an example of a liquid crystal display module, inwhich the TFT substrate 2600 and a counter substrate 2601 are fixed toeach other with a sealant 2602, and a pixel portion 2603 including a TFTor the like, a display element 2604 including a liquid crystal layer,and a coloring layer 2605 are provided between the substrates to form adisplay region. The coloring layer 2605 is necessary to perform colordisplay. In the case of the RGB system, respective coloring layerscorresponding to colors of red, green, and blue are provided forrespective pixels. Polarizing plates 2606 and 2607 and a diffusion plate2613 are provided outside the TFT substrate 2600 and the countersubstrate 2601. A light source includes a cold cathode tube 2610 and areflective plate 2611, and a circuit substrate 2612 is connected to awiring circuit portion 2608 of the TFT substrate 2600 through a flexiblewiring board 2609 and includes an external circuit such as a controlcircuit or a power source circuit. The polarizing plate and the liquidcrystal layer may be stacked with a retardation plate interposedtherebetween.

For the liquid crystal display module, a twisted nematic (TN) mode, anin-plane-switching (IPS) mode, a fringe field switching (FFS) mode, amulti-domain vertical alignment (MVA) mode, a patterned verticalalignment (PVA) mode, an axially symmetric aligned micro-cell (ASM)mode, an optical compensated birefringence (OCB) mode, a ferroelectricliquid crystal (FLC) mode, an antiferroelectric liquid crystal (AFLC)mode, or the like can be used.

Through this process, a highly reliable liquid crystal display panel asa semiconductor device can be manufactured.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 6

In this embodiment, an example of electronic paper will be described asa semiconductor device to which the thin film transistor described inany of Embodiments 1 to 3 is applied.

FIG. 13 illustrates active matrix electronic paper as an example of asemiconductor device. A thin film transistor 581 used for thesemiconductor device can be manufactured by application of the thin filmtransistor described in any of Embodiments 1 to 3.

The electronic paper in FIG. 13 is an example of a display device usinga twisting ball display system. The twisting ball display system refersto a method in which spherical particles each colored in black or whiteare arranged between a first electrode layer and a second electrodelayer which are electrode layers used for a display element, and apotential difference is generated between the first electrode layer andthe second electrode layer to control orientation of the sphericalparticles, so that display is performed.

The thin film transistor 581 which is sealed between a substrate 580 anda substrate 596 is a thin film transistor with a bottom gate structure,and a source or drain electrode layer thereof is in contact with a firstelectrode layer 587 through an opening formed in insulating layers 583,584 and 585, whereby the thin film transistor 581 is electricallyconnected to the first electrode layer 587. Between the first electrodelayer 587 and a second electrode layer 588, spherical particles 589 eachhaving a black region 590 a, a white region 590 b, and a cavity 594around the regions which is filled with liquid are provided. A spacearound the spherical particles 589 is filled with a filler 595 such as aresin (see FIG. 13). In this embodiment, the first electrode layer 587corresponds to the pixel electrode and the second electrode layer 588corresponds to the common electrode. The second electrode layer 588 iselectrically connected to a common potential line provided over the samesubstrate as the thin film transistor 581. With the use of the commonconnection portion, the second electrode layer 588 is electricallyconnected to the common potential line through conductive particlesprovided between the pair of substrates.

Further, instead of the twisting ball, an electrophoretic element canalso be used. A microcapsule having a diameter of about 10 μm to 200 μmin which transparent liquid, positively charged white microparticles,and negatively charged black microparticles are encapsulated, is used.In the microcapsule which is provided between the first electrode layerand the second electrode layer, when an electric field is applied by thefirst electrode layer and the second electrode layer, the whitemicroparticles and the black microparticles move to opposite sides, sothat white or black can be displayed. A display element using thisprinciple is an electrophoretic display element and is called electronicpaper in general. The electrophoretic display element has higherreflectance than a liquid crystal display element, and thus, anauxiliary light is unnecessary, power consumption is low, and a displayportion can be recognized in a dim place. In addition, even when poweris not supplied to the display portion, an image which has beendisplayed once can be maintained. Accordingly, a displayed image can bestored even if a semiconductor device having a display function (whichmay be referred to simply as a display device or a semiconductor deviceprovided with a display device) is distanced from an electric wavesource.

Through this process, highly reliable electronic paper as asemiconductor device can be manufactured.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 7

In this embodiment, an example of a light-emitting display device willbe described as a semiconductor device to which the thin film transistordescribed in any of Embodiments 1 to 3 is applied. As a display elementincluded in a display device, a light-emitting element utilizingelectroluminescence is described here. Light-emitting elements utilizingelectroluminescence are classified according to whether a light-emittingmaterial is an organic compound or an inorganic compound. In general,the former is referred to as an organic EL element, and the latter isreferred to as an inorganic EL element.

In an organic EL element, by application of voltage to a light-emittingelement, electrons and holes are separately injected from a pair ofelectrodes into a layer containing a light-emitting organic compound,and current flows. The carriers (electrons and holes) are recombined,and thus, the light-emitting organic compound is excited. Thelight-emitting organic compound returns to a ground state from theexcited state, thereby emitting light. Owing to such a mechanism, thislight-emitting element is referred to as a current-excitationlight-emitting element.

The inorganic EL elements are classified according to their elementstructures into a dispersion-type inorganic EL element and a thin-filminorganic EL element. A dispersion-type inorganic EL element has alight-emitting layer where particles of a light-emitting material aredispersed in a binder, and its light emission mechanism isdonor-acceptor recombination type light emission that utilizes a donorlevel and an acceptor level. A thin-film inorganic EL element has astructure where a light-emitting layer is sandwiched between dielectriclayers, which are further sandwiched between electrodes, and its lightemission mechanism is localized type light emission that utilizesinner-shell electron transition of metal ions. Note that description ismade here using an organic EL element as a light-emitting element.

FIG. 20 illustrates an example of a pixel structure to which digitaltime grayscale driving can be applied, as an example of a semiconductordevice to which an example of the present invention is applied.

A structure and operation of a pixel to which digital time grayscaledriving can be applied are described. Here, one pixel includes twon-channel transistors each of which includes an oxide semiconductorlayer (an In—Ga—Zn—O-based non-single-crystal film) in a channelformation region and each of which is described in any of Embodiments 1to 3.

A pixel 6400 includes a switching transistor 6401, a driver transistor6402, a light-emitting element 6404, and a capacitor 6403. A gate of theswitching transistor 6401 is connected to a scan line 6406, a firstelectrode (one of a source electrode and a drain electrode) of theswitching transistor 6401 is connected to a signal line 6405, and asecond electrode (the other of the source electrode and the drainelectrode) of the switching transistor 6401 is connected to a gate ofthe driver transistor 6402. The gate of the driver transistor 6402 isconnected to a power supply line 6407 through the capacitor 6403, afirst electrode of the driver transistor 6402 is connected to the powersupply line 6407, and a second electrode of the driver transistor 6402is connected to a first electrode (pixel electrode) of thelight-emitting element 6404. A second electrode of the light-emittingelement 6404 corresponds to a common electrode 6408. The commonelectrode 6408 is electrically connected to a common potential lineprovided over the same substrate, and the structure illustrated in FIG.1A, FIG. 2A, or FIG. 3A may be obtained using the connection portion asa common connection portion.

The second electrode (the common electrode 6408) of the light-emittingelement 6404 is set to a low power supply potential. Note that the lowpower supply potential is a potential satisfying the low power supplypotential<a high power supply potential with reference to the high powersupply potential that is set to the power supply line 6407. As the lowpower supply potential, GND, 0 V, or the like may be employed, forexample. A potential difference between the high power supply potentialand the low power supply potential is applied to the light-emittingelement 6404 and current is supplied to the light-emitting element 6404,so that the light-emitting element 6404 emits light. Here, in order tomake the light-emitting element 6404 emit light, each potential is setso that the potential difference between the high power supply potentialand the low power supply potential is a forward threshold voltage orhigher.

Note that gate capacitance of the driver transistor 6402 may be used asa substitute for the capacitor 6403, so that the capacitor 6403 can beomitted. The gate capacitance of the driver transistor 6402 may beformed between the channel region and the gate electrode.

In the case of a voltage-input voltage driving method, a video signal isinput to the gate of the driver transistor 6402 so that the drivertransistor 6402 is in either of two states of being sufficiently turnedon and turned off. That is, the driver transistor 6402 operates in alinear region. Since the driver transistor 6402 operates in a linearregion, a voltage higher than the voltage of the power supply line 6407is applied to the gate of the driver transistor 6402. Note that avoltage higher than or equal to (voltage of the power supply line+Vth ofthe driver transistor 6402) is applied to the signal line 6405.

In the case of performing analog grayscale driving instead of digitaltime grayscale driving, the same pixel structure as that in FIG. 20 canbe used by changing signal input.

In the case of performing analog grayscale driving, a voltage higherthan or equal to (forward voltage of the light-emitting element 6404+Vthof the driver transistor 6402) is applied to the gate of the drivertransistor 6402. The forward voltage of the light-emitting element 6404indicates a voltage at which a desired luminance is obtained, andincludes at least forward threshold voltage. The video signal by whichthe driver transistor 6402 operates in a saturation region is input, sothat current can be supplied to the light-emitting element 6404. Inorder for the driver transistor 6402 to operate in a saturation region,the potential of the power supply line 6407 is set higher than the gatepotential of the driver transistor 6402. When an analog video signal isused, it is possible to feed current to the light-emitting element 6404in accordance with the video signal and perform analog grayscaledriving.

Note that the pixel structure illustrated in FIG. 20 is not limitedthereto. For example, a switch, a resistor, a capacitor, a transistor, alogic circuit, or the like may be added to the pixel illustrated in FIG.20.

Next, structures of the light-emitting element will be described withreference to FIGS. 21A to 21C. A cross-sectional structure of a pixelwill be described by taking an n-channel driving TFT as an example.Driving TFTs 7001, 7011, and 7021 used for semiconductor devicesillustrated in FIGS. 21A to 21C can be formed in a manner similar toformation of the thin film transistor described in any of Embodiments 1to 3 and are highly reliable thin film transistors each including anIn—Ga—Zn—O-based non-single-crystal film as an oxide semiconductorlayer.

In order to extract light emitted from the light-emitting element, atleast one of the anode and the cathode is required to transmit light. Athin film transistor and a light-emitting element are formed over asubstrate. A light-emitting element can have a top emission structure,in which light emission is extracted through the surface opposite to thesubstrate; a bottom emission structure, in which light emission isextracted through the surface on the substrate side; or a dual emissionstructure, in which light emission is extracted through the surfaceopposite to the substrate and the surface on the substrate side. A pixelstructure of an example of the present invention can be applied to alight-emitting element having any of these emission structures.

A light-emitting element having a top emission structure will bedescribed with reference to FIG. 21A.

FIG. 21A is a cross-sectional view of a pixel in the case where thedriving TFT 7001 is an n-channel TFT and light is emitted from alight-emitting element 7002 to an anode 7005 side. In FIG. 21A, acathode 7003 of the light-emitting element 7002 is electricallyconnected to the driving TFT 7001, and a light-emitting layer 7004 andthe anode 7005 are stacked in this order over the cathode 7003. Thecathode 7003 can be formed using a variety of conductive materials aslong as they have a low work function and reflect light. For example,Ca, Al, MgAg, AlLi, or the like is preferably used. The light-emittinglayer 7004 may be formed using a single layer or a plurality of layersstacked. When the light-emitting layer 7004 is formed using a pluralityof layers, the light-emitting layer 7004 is formed by stacking anelectron-injecting layer, an electron-transporting layer, alight-emitting layer, a hole-transporting layer, and a hole-injectinglayer in this order over the cathode 7003. It is not necessary to formall of these layers. The anode 7005 is formed using a light-transmittingconductive film such as a film of indium oxide including tungsten oxide,indium zinc oxide including tungsten oxide, indium oxide includingtitanium oxide, indium tin oxide including titanium oxide, indium tinoxide (hereinafter referred to as ITO), indium zinc oxide, or indium tinoxide to which silicon oxide is added.

The light-emitting element 7002 corresponds to a region where thelight-emitting layer 7004 is sandwiched between the cathode 7003 and theanode 7005. In the case of the pixel illustrated in FIG. 21A, light isemitted from the light-emitting element 7002 to the anode 7005 side asindicated by an arrow.

Next, a light-emitting element having a bottom emission structure willbe described with reference to FIG. 21B. FIG. 21B is a cross-sectionalview of a pixel in the case where the driving TFT 7011 is an n-channeltransistor and light is emitted from a light-emitting element 7012 to acathode 7013 side. In FIG. 21B, the cathode 7013 of the light-emittingelement 7012 is formed over a light-transmitting conductive film 7017that is electrically connected to the driving TFT 7011, and alight-emitting layer 7014 and an anode 7015 are stacked in this orderover the cathode 7013. A light-blocking film 7016 for reflecting orblocking light may be formed to cover the anode 7015 when the anode 7015has a light-transmitting property. For the cathode 7013, a variety ofmaterials can be used as in the case of FIG. 21A as long as they areconductive materials having a low work function. The cathode 7013 isformed to have a thickness that can transmit light (preferably,approximately 5 nm to 30 nm). For example, an aluminum film with athickness of 20 nm can be used as the cathode 7013. In a manner similarto the case of FIG. 21A, the light-emitting layer 7014 may be formedusing either a single layer or a plurality of layers stacked. The anode7015 is not required to transmit light, but can be formed using alight-transmitting conductive material as in the case of FIG. 21A. Asthe light-blocking film 7016, a metal or the like that reflects lightcan be used for example; however, it is not limited to a metal film. Forexample, a resin or the like to which black pigments are added can alsobe used.

The light-emitting element 7012 corresponds to a region where thelight-emitting layer 7014 is sandwiched between the cathode 7013 and theanode 7015. In the case of the pixel illustrated in FIG. 21B, light isemitted from the light-emitting element 7012 to the cathode 7013 side asindicated by an arrow.

Next, a light-emitting element having a dual emission structure will bedescribed with reference to FIG. 21C. In FIG. 21C, a cathode 7023 of alight-emitting element 7022 is formed over a light-transmittingconductive film 7027 which is electrically connected to the driving TFT7021, and a light-emitting layer 7024 and an anode 7025 are stacked inthis order over the cathode 7023. As in the case of FIG. 21A, thecathode 7023 can be formed using a variety of conductive materials aslong as they have a low work function. The cathode 7023 is formed tohave a thickness that can transmit light. For example, a film of Alhaving a thickness of 20 nm can be used as the cathode 7023. As in FIG.21A, the light-emitting layer 7024 may be formed using either a singlelayer or a plurality of layers stacked. The anode 7025 can be formedusing a light-transmitting conductive material as in the case of FIG.21A.

The light-emitting element 7022 corresponds to a region where thecathode 7023, the light-emitting layer 7024, and the anode 7025 overlapwith one another. In the case of the pixel illustrated in FIG. 21C,light is emitted from the light-emitting element 7022 to both the anode7025 side and the cathode 7023 side as indicated by arrows.

Note that, although an organic EL element is described here as alight-emitting element, an inorganic EL element can also be provided asa light-emitting element.

In this embodiment, the example is described in which a thin filmtransistor (a driving TFT) which controls the driving of alight-emitting element is electrically connected to the light-emittingelement; however, a structure may be employed in which a TFT for currentcontrol is connected between the driving TFT and the light-emittingelement.

A semiconductor device described in this embodiment is not limited tothe structures illustrated in FIGS. 21A to 21C and can be modified invarious ways based on the spirit of techniques according to the presentinvention.

Next, the appearance and a cross section of a light-emitting displaypanel (also referred to as a light-emitting panel), which is oneembodiment of a semiconductor device to which the thin film transistordescribed in any of Embodiments 1 to 3 is applied, will be describedwith reference to FIGS. 24A and 24B. FIG. 24A is a top view of a panelin which a thin film transistor and a light-emitting element formed overa first substrate are sealed between the first substrate and a secondsubstrate with a sealant. FIG. 24B is a cross-sectional view taken alongline H-I of FIG. 24A.

A sealant 4505 is provided so as to surround a pixel portion 4502,signal line driver circuits 4503 a and 4503 b, and scan line drivercircuits 4504 a and 4504 b which are provided over a first substrate4501. In addition, a second substrate 4506 is provided over the pixelportion 4502, the signal line driver circuits 4503 a and 4503 b, and thescan line driver circuits 4504 a and 4504 b. Accordingly, the pixelportion 4502, the signal line driver circuits 4503 a and 4503 b, and thescan line driver circuits 4504 a and 4504 b are sealed together with afiller 4507, by the first substrate 4501, the sealant 4505, and thesecond substrate 4506. It is preferable that a panel be packaged(sealed) with a protective film (such as a laminate film or anultraviolet curable resin film) or a cover material with highair-tightness and little degasification so that the panel is not exposedto the outside air as described above.

The pixel portion 4502, the signal line driver circuits 4503 a and 4503b, and the scan line driver circuits 4504 a and 4504 b formed over thefirst substrate 4501 each include a plurality of thin film transistors,and a thin film transistor 4510 included in the pixel portion 4502 and athin film transistor 4509 included in the signal line driver circuit4503 a are illustrated as an example in FIG. 24B.

The highly reliable thin film transistor including an In—Ga—Zn—O-basednon-single-crystal film as an oxide semiconductor layer, which isdescribed in any of Embodiments 1 to 3, can be employed as the thin filmtransistors 4509 and 4510. In this embodiment, the thin film transistors4509 and 4510 are n-channel thin film transistors.

Moreover, reference numeral 4511 denotes a light-emitting element. Afirst electrode layer 4517 which is a pixel electrode included in thelight-emitting element 4511 is electrically connected to a sourceelectrode layer or a drain electrode layer of the thin film transistor4510. Note that a structure of the light-emitting element 4511 is astacked-layer structure of the first electrode layer 4517, anelectroluminescent layer 4512, and a second electrode layer 4513, butthe present invention is not limited to that described in thisembodiment. The structure of the light-emitting element 4511 can bechanged as appropriate depending on the direction in which light isextracted from the light-emitting element 4511, or the like.

A partition wall 4520 is formed using an organic resin film, aninorganic insulating film, or organic polysiloxane. It is particularlypreferable that the partition wall 4520 be formed using a photosensitivematerial and an opening be formed over the first electrode layer 4517 sothat a sidewall of the opening is formed as an inclined surface withcontinuous curvature.

The electroluminescent layer 4512 may be formed with a single layer or aplurality of layers stacked.

A protective film may be formed over the second electrode layer 4513 andthe partition wall 4520 in order to prevent entry of oxygen, hydrogen,moisture, carbon dioxide, or the like into the light-emitting element4511. As the protective film, a silicon nitride film, a silicon nitrideoxide film, a DLC film, or the like can be formed.

In addition, a variety of signals and potentials are supplied to thesignal line driver circuits 4503 a and 4503 b, the scan line drivercircuits 4504 a and 4504 b, or the pixel portion 4502 from FPCs 4518 aand 4518 b.

In this embodiment, a connection terminal electrode 4515 is formed fromthe same conductive film as the first electrode layer 4517 included inthe light-emitting element 4511, and a terminal electrode 4516 is formedfrom the same conductive film as the source and drain electrode layersincluded in the thin film transistors 4509 and 4510.

The connection terminal electrode 4515 is electrically connected to aterminal included in the FPC 4518 a through an anisotropic conductivefilm 4519.

The second substrate 4506 located in the direction in which light isextracted from the light-emitting element 4511 needs to have alight-transmitting property. In that case, a light-transmitting materialsuch as a glass plate, a plastic plate, a polyester film, or an acrylicfilm is used.

As the filler 4507, an ultraviolet curable resin or a thermosettingresin can be used, in addition to an inert gas such as nitrogen orargon. For example, PVC (polyvinyl chloride), acrylic, polyimide, anepoxy resin, a silicone resin, PVB (polyvinyl butyral), or EVA (ethylenevinyl acetate) can be used. In this embodiment, nitrogen is used for thefiller 4507.

In addition, if needed, an optical film, such as a polarizing plate, acircularly polarizing plate (including an elliptically polarizingplate), a retardation plate (a quarter-wave plate or a half-wave plate),or a color filter, may be provided as appropriate on a light-emittingsurface of the light-emitting element. Further, the polarizing plate orthe circularly polarizing plate may be provided with an anti-reflectionfilm. For example, anti-glare treatment by which reflected light can bediffused by projections and depressions on the surface so as to reducethe glare can be performed.

The signal line driver circuits 4503 a and 4503 b and the scan linedriver circuits 4504 a and 4504 b may be provided as driver circuitsformed using a single crystal semiconductor film or polycrystallinesemiconductor film over a substrate separately prepared. In addition,only the signal line driver circuits or part thereof, or only the scanline driver circuits or part thereof may be separately formed andmounted. This embodiment is not limited to the structure illustrated inFIGS. 24A and 24B.

Through this process, a highly reliable light-emitting display device(display panel) as a semiconductor device can be manufactured.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 8

A semiconductor device to which the thin film transistor described inany of Embodiments 1 to 3 is applied can be used as electronic paper.Electronic paper can be used for electronic devices of a variety offields as long as they can display data. For example, electronic papercan be applied to an electronic book (e-book) reader, a poster, anadvertisement in a vehicle such as a train, displays of various cardssuch as a credit card, and the like. Examples of the electronic devicesare illustrated in FIGS. 25A and 25B and FIG. 26.

FIG. 25A illustrates a poster 2631 formed using electronic paper. In thecase where an advertising medium is printed paper, the advertisement isreplaced by manpower; however, by using electronic paper, theadvertising display can be changed in a short time. Further, an imagecan be stably displayed without being distorted. Note that the postermay be configured to transmit and receive data wirelessly.

FIG. 25B illustrates an advertisement 2632 in a vehicle such as a train.In the case where an advertising medium is printed paper, theadvertisement is replaced by manpower; however, by using electronicpaper, the advertising display can be changed in a short time without alot of manpower. Further, an image can be stably displayed without beingdistorted. Note that the advertisement in a vehicle may be configured totransmit and receive data wirelessly.

FIG. 26 illustrates an example of an electronic book reader 2700. Forexample, the electronic book reader 2700 includes two housings, ahousing 2701 and a housing 2703. The housing 2701 and the housing 2703are combined with a hinge 2711 so that the electronic book reader 2700can be opened and closed with the hinge 2711 as an axis. With such astructure, the electronic book reader 2700 can be operated like a paperbook.

A display portion 2705 and a display portion 2707 are incorporated inthe housing 2701 and the housing 2703, respectively. The display portion2705 and the display portion 2707 may be configured to display one imageor different images. In the case where the display portion 2705 and thedisplay portion 2707 display different images, for example, a displayportion on the right side (the display portion 2705 in FIG. 26) candisplay text and a display portion on the left side (the display portion2707 in FIG. 26) can display graphics.

FIG. 26 illustrates an example in which the housing 2701 is providedwith an operation portion and the like. For example, the housing 2701 isprovided with a power switch 2721, an operation key 2723, a speaker2725, and the like. With the operation key 2723, pages can be turned.Note that a keyboard, a pointing device, or the like may be provided onthe surface of the housing, on which the display portion is provided.Further, an external connection terminal (an earphone terminal, a USBterminal, a terminal that can be connected to various cables such as anAC adapter and a USB cable, or the like), a recording medium insertportion, or the like may be provided on the back surface or the sidesurface of the housing. Further, the electronic book reader 2700 mayhave a function of an electronic dictionary.

The electronic book reader 2700 may be configured to transmit andreceive data wirelessly. The structure can be employed in which desiredbook data or the like is purchased and downloaded from an electronicbook server wirelessly.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Embodiment 9

A semiconductor device using the thin film transistor described in anyof Embodiments 1 to 3 can be applied to a variety of electronic devices(including an amusement machine). Examples of electronic devices includea television set (also referred to as a television or a televisionreceiver), a monitor of a computer or the like, a camera such as adigital camera or a digital video camera, a digital photo frame, amobile phone handset (also referred to as a mobile phone or a mobilephone device), a portable game console, a portable information terminal,an audio reproducing device, a large-sized game machine such as apachinko machine, and the like.

FIG. 27A illustrates an example of a television set 9600. In thetelevision set 9600, a display portion 9603 is incorporated in a housing9601. The display portion 9603 can display an image. Further, thehousing 9601 is supported by a stand 9605 here.

The television set 9600 can be operated with an operation switch of thehousing 9601 or a separate remote controller 9610. Channels and volumecan be controlled with an operation key 9609 of the remote controller9610 so that an image displayed on the display portion 9603 can becontrolled. Further, the remote controller 9610 may be provided with adisplay portion 9607 for displaying data output from the remotecontroller 9610.

Note that the television set 9600 is provided with a receiver, a modem,and the like. With the receiver, a general television broadcast can bereceived. Further, when the television set 9600 is connected to acommunication network by wired or wireless connection via the modem,one-way (from a transmitter to a receiver) or two-way (between atransmitter and a receiver or between receivers) data communication canbe performed.

FIG. 27B illustrates an example of a digital photo frame 9700. Forexample, in the digital photo frame 9700, a display portion 9703 isincorporated in a housing 9701. The display portion 9703 can displayvarious images. For example, the display portion 9703 can display dataof an image taken with a digital camera or the like and function as anormal photo frame.

Note that the digital photo frame 9700 is provided with an operationportion, an external connection terminal (a USB terminal, a terminalthat can be connected to various cables such as a USB cable, or thelike), a recording medium insertion portion, and the like. Althoughthese components may be provided on the surface on which the displayportion is provided, it is preferable to provide them on the sidesurface or the back surface for the design of the digital photo frame9700. For example, a memory storing data of an image taken with adigital camera is inserted in the recording medium insertion portion ofthe digital photo frame, whereby the image data can be transferred andthen displayed on the display portion 9703.

The digital photo frame 9700 may be configured to transmit and receivedata wirelessly. The structure may be employed in which desired imagedata is transferred wirelessly to be displayed.

FIG. 28A is a portable game machine and includes two housings, a housing9881 and a housing 9891, which are connected with a joint portion 9893so that the portable game machine can be opened or folded. A displayportion 9882 is incorporated in the housing 9881, and a display portion9883 is incorporated in the housing 9891. In addition, the portable gamemachine illustrated in FIG. 28A is provided with a speaker portion 9884,a recording medium insert portion 9886, an LED lamp 9890, input means(operation keys 9885, a connection terminal 9887, a sensor 9888 (havinga function of measuring force, displacement, position, speed,acceleration, angular velocity, rotation number, distance, light,liquid, magnetism, temperature, chemical substance, sound, time,hardness, electric field, current, voltage, electric power, radial ray,flow rate, humidity, gradient, vibration, odor, or infrared ray), and amicrophone 9889), and the like. Needless to say, the structure of theportable game machine is not limited to that described above. Theportable game machine may have a structure in which additional accessoryequipment is provided as appropriate as long as at least a semiconductordevice according to an example of the present invention is provided. Theportable game machine illustrated in FIG. 28A has a function of readinga program or data stored in a recording medium to display it on thedisplay portion, and a function of sharing information with anotherportable game machine by wireless communication. Note that a function ofthe portable game machine illustrated in FIG. 28A is not limited tothose described above, and the portable game machine can have a varietyof functions.

FIG. 28B illustrates an example of a slot machine 9900 which is alarge-sized amusement machine. In the slot machine 9900, a displayportion 9903 is incorporated in a housing 9901. In addition, the slotmachine 9900 is provided with operation means such as a start lever anda stop switch, a coin slot, a speaker, or the like. Needless to say, thestructure of the slot machine 9900 is not limited to the above-describedstructure. The slot machine may have a structure in which additionalaccessory equipment is provided as appropriate as long as at least asemiconductor device according to an example of the present invention isprovided.

FIG. 29A illustrates an example of a mobile phone handset 1000. Themobile phone handset 1000 is provided with a display portion 1002incorporated in a housing 1001, operation buttons 1003, an externalconnection port 1004, a speaker 1005, a microphone 1006, and the like.

When the display portion 1002 of the mobile phone handset 1000illustrated in FIG. 29A is touched with a finger or the like, data canbe input into the mobile phone handset 1000. Further, operation such asmaking calls and texting can be performed by touching the displayportion 1002 with a finger or the like.

There are mainly three screen modes of the display portion 1002. Thefirst mode is a display mode mainly for displaying an image. The secondmode is an input mode mainly for inputting data such as text. The thirdmode is a display-and-input mode which is a combination of the twomodes, that is, a combination of the display mode and the input mode.

For example, in the case of making a call or texting, a text input modemainly for inputting text is selected for the display portion 1002 sothat characters displayed on a screen can be inputted. In that case, itis preferable to display a keyboard or number buttons on almost all areaof the screen of the display portion 1002.

When a detection device including a sensor for detecting inclination,such as a gyroscope or an acceleration sensor, is provided inside themobile phone handset 1000, display on the screen of the display portion1002 can be automatically changed by determining the orientation of themobile phone handset 1000 (whether the mobile phone handset 1000 isplaced horizontally or vertically for a landscape mode or a portraitmode).

The screen modes are changed by touching the display portion 1002 orusing the operation buttons 1003 of the housing 1001. Alternatively, thescreen modes may be changed depending on the kind of the image displayedon the display portion 1002. For example, when a signal of an imagedisplayed on the display portion is the one of moving image data, thescreen mode is changed to the display mode. When the signal is the oneof text data, the screen mode is changed to the input mode.

Further, in the input mode, when input by touching the display portion1002 is not performed for a certain period while a signal detected bythe optical sensor in the display portion 1002 is detected, the screenmode may be controlled so as to be changed from the input mode to thedisplay mode.

The display portion 1002 may function as an image sensor. For example,an image of a palm print, a fingerprint, or the like is taken when thedisplay portion 1002 is touched with a palm or a finger, wherebypersonal identification can be performed. Further, by providing abacklight or a sensing light source which emits a near-infrared light inthe display portion, an image of a finger vein, a palm vein, or the likecan be taken.

FIG. 29B illustrates another example of a cellular phone. The cellularphone in FIG. 29B has a display device 9410 in a housing 9411, whichincludes a display portion 9412 and operation buttons 9413, and acommunication device 9400 in a housing 9401, which includes operationbuttons 9402, an external input terminal 9403, a microphone 9404, aspeaker 9405, and a light-emitting portion 9406 that emits light when aphone call is received. The display device 9410 which has a displayfunction can be detached from or attached to the communication device9400 which has a phone function by moving in two directions representedby allows. Thus, the display device 9410 and the communication device9400 can be attached to each other along their short sides or longsides. In addition, when only the display function is needed, thedisplay device 9410 can be detached from the communication device 9400and used alone. Images or input information can be transmitted orreceived by wireless or wire communication between the communicationdevice 9400 and the display device 9410, each of which has arechargeable battery.

Note that the structure described in this embodiment can be combinedwith any of the structures described in another embodiment asappropriate.

Example 1

In this example, results in which dependence of electrical conductivityof an oxide semiconductor film on the proportion of the flow rate of anoxygen gas during film formation is measured are described.

In this example, In—Ga—Zn—O-based non-single-crystal films were formedby a sputtering method, and the electrical conductivity of the formedIn—Ga—Zn—O-based non-single-crystal films was measured. Samples wereformed under a condition where the proportion of the flow rate of anoxygen gas during film formation was changed from 0 volume % to 100volume % among the samples, and each electrical conductivity of theIn—Ga—Zn—O-based non-single-crystal films formed by varying theproportion of the flow rate of the oxygen gas among the samples wasmeasured. Note that the electrical conductivity was measured using asemiconductor parameter analyzer HP4155C (made by Agilent TechnologiesInc.).

The In—Ga—Zn—O-based non-single-crystal films were formed by sputtering,with use of a disk-shaped oxide semiconductor target of 8 inches indiameter, in which In₂O₃, Ga₂O₃, and ZnO are mixed in the ratio ofIn₂O₃:Ga₂O₃:ZnO=1:1:1 (In:Ga:Zn=1:1:0.5), as a target. As other filmformation conditions, the distance between a substrate and the targetwas set to 170 mm; the pressure for a film-forming gas was set to 0.4Pa; the direct-current (DC) power source was set to 0.5 kW; and theformation temperature was set to room temperature.

As a film-forming gas, an argon gas and an oxygen gas were used. Filmformation was performed under the condition where the proportion of theflow rate of the oxygen gas in the argon gas and the oxygen gas waschanged from 0 volume % to 100 volume % among the samples, and eachelectrical conductivity of the In—Ga—Zn—O-based non-single-crystal filmswas measured. Note that, in order to perform rearrangement at the atomiclevel on each of the In—Ga—Zn—O-based non-single-crystal films, heattreatment at 350° C. in a nitrogen atmosphere was performed for one hourafter each of the In—Ga—Zn—O-based non-single-crystal films was formed.

Each electrical conductivity of the In—Ga—Zn—O-based non-single-crystalfilms formed by varying the proportion of the flow rate of the oxygengas among the samples is shown in FIG. 12. In FIG. 12, the horizontalaxis represents the proportion of the flow rate of the oxygen gas(volume %) in the flow rate of the argon gas and the flow rate of theoxygen gas, and the vertical axis represents the electrical conductivity(S/cm) of the In—Ga—Zn—O-based non-single-crystal films. Further, Table1 is a table corresponding to FIG. 12, and shows the flow rate of theargon gas (sccm), the flow rate of the oxygen gas (sccm), the proportionof the flow rate of the oxygen gas (volume %), and the electricalconductivity of each of the In—Ga—Zn—O-based non-single-crystal films(S/cm).

TABLE 1 Proportion of flow rate of Conductivity Ar (sccm) O₂ (sccm)oxygen gas (volume %) (S/cm) 50 0 0 6.44 × 10⁰    40 5 11.1 7.01 × 10⁻⁵ 40 10 20 5.24 × 10⁻⁵  30 15 33.3 1.23 × 10⁻⁴  30 20 40 3.98 × 10⁻⁵  2525 50 1.52 × 10⁻⁶  20 30 60 2.92 × 10⁻⁷  15 35 70 2.68 × 10⁻⁹  10 40 802.57 × 10⁻¹⁰ 5 45 90 1.59 × 10⁻¹⁰ 0 50 100 4.19 × 10⁻¹¹

From the results in FIG. 12 and Table 1, when the proportion of the flowrate of the oxygen gas is 0 volume % to 11.1 volume %, the electricalconductivity is significantly decreased; when the proportion of the flowrate of the oxygen gas is 11.1 volume % to 40 volume %, the electricalconductivity is about 1.0×10⁻⁵ S/cm to 1.0×10⁻⁴ S/cm; and when theproportion of the flow rate of the oxygen gas is 40 volume % or higher,the electrical conductivity is gradually decreased. Note that, when theproportion of the flow rate of the oxygen gas is 60 volume % to 70volume %, decrease in the electrical conductivity is comparativelylarge. Here, the maximum value of the electrical conductivity is 6.44S/cm under the condition where the proportion of the flow rate of theoxygen gas is 0 volume %, that is, under the condition where only theargon gas is used as the film-forming gas. The minimum value of theelectrical conductivity is 4.19×10⁻¹¹ S/cm under the condition where theproportion of the flow rate of the oxygen gas is 100 volume %, that is,under the condition where only the oxygen gas is used as thefilm-forming gas.

For formation of the semiconductor layer having higher electricalconductivity and the oxide semiconductor layer having lower electricalconductivity, the condition of the flow rate of the oxygen gas isdifferentiated from each other at around 10 volume % as a boundary,where gradient of the electrical conductivity is steep in a graph ofFIG. 12, whereby difference in the electrical conductivity between thesemiconductor layer and the oxide semiconductor layer can be made large.Therefore, when the In—Ga—Zn—O-based non-single-crystal film used forthe semiconductor layer having high electrical conductivity is formed,the proportion of the flow rate of the oxygen gas is preferably set tolower than 10 volume %, that is, the electrical conductivity ispreferably higher than 1.0×10⁻³ S/cm. In addition, when theIn—Ga—Zn—O-based non-single-crystal film used for the oxidesemiconductor layer having lower electrical conductivity than thesemiconductor layer is formed, the proportion of the flow rate of theoxygen gas is preferably set to 10 volume % or higher, that is, theelectrical conductivity is preferably 1.0×10⁻³ S/cm or lower.

Alternatively, a boundary may be set around 70 volume % of theproportion of the flow rate of the oxygen gas in the graph of FIG. 12where decrease in the electrical conductivity is comparatively large. Inthis case, when the In—Ga—Zn—O-based non-single-crystal film used forthe semiconductor layer having high electrical conductivity is formed,the proportion of the flow rate of the oxygen gas is preferably set tolower than 70 volume %, that is, the electrical conductivity ispreferably higher than 1.0×10⁻⁸ S/cm. Further, when the In—Ga—Zn—O-basednon-single-crystal film used for the oxide semiconductor layer havinglower electrical conductivity than the semiconductor layer is formed,the proportion of the flow rate of the oxygen gas is preferably set to70 volume % or higher, that is, the electrical conductivity ispreferably 1.0×10⁻⁸ S/cm or lower.

This application is based on Japanese Patent Application serial no.2008-281174 filed with Japan Patent Office on Oct. 31, 2008, the entirecontents of which are hereby incorporated by reference.

1. (canceled)
 2. A method of manufacturing a semiconductor devicecomprising the steps of: forming a gate insulating film over a gateelectrode; forming a first non-single crystalline oxide semiconductorfilm by sputtering over the gate electrode with the gate insulating filminterposed therebetween; forming a second non-single crystalline oxidesemiconductor film by sputtering over the first non-single crystallineoxide semiconductor film, the second non-single crystalline oxidesemiconductor film having a lower electrical conductivity than the firstnon-single crystalline oxide semiconductor film; etching the firstnon-single crystalline oxide semiconductor film and the secondnon-single crystalline oxide semiconductor film to form a first oxidesemiconductor layer and a second oxide semiconductor layer on the firstoxide semiconductor layer; and forming a source electrode and a drainelectrode in electrical contact with the second oxide semiconductorlayer, wherein each of the first non-single crystalline oxidesemiconductor film and the second non-single crystalline oxidesemiconductor film comprises indium, gallium and zinc, wherein aproportion of a flow rate of an oxygen gas in a film-forming gas forforming the first non-single crystalline oxide semiconductor film islower than 10 volume %, and wherein a proportion of a flow rate of anoxygen gas in a film-forming gas for forming the second non-singlecrystalline oxide semiconductor film is 10 volume % or higher.
 3. Themethod according to claim 2, wherein the first non-single crystallineoxide semiconductor film is formed at room temperature.
 4. The methodaccording to claim 2, wherein the second non-single crystalline oxidesemiconductor film is formed at room temperature.
 5. The methodaccording to claim 2, further comprising a step of heat treatment at atemperature of 250 to 500° C. after forming the source electrode and thedrain electrode.
 6. A method of manufacturing a semiconductor devicecomprising the steps of: forming a gate insulating film over a gateelectrode; forming a first non-single crystalline oxide semiconductorfilm by sputtering over the gate electrode with the gate insulating filminterposed therebetween; forming a second non-single crystalline oxidesemiconductor film by sputtering over the first non-single crystallineoxide semiconductor film, the second non-single crystalline oxidesemiconductor film having a lower electrical conductivity than the firstnon-single crystalline oxide semiconductor film; etching the firstnon-single crystalline oxide semiconductor film and the secondnon-single crystalline oxide semiconductor film to form a first oxidesemiconductor layer and a second oxide semiconductor layer on the firstoxide semiconductor layer; and forming a source electrode and a drainelectrode in electrical contact with the second oxide semiconductorlayer, wherein each of the first non-single crystalline oxidesemiconductor film and the second non-single crystalline oxidesemiconductor film comprises indium, gallium and zinc, wherein aproportion of a flow rate of an oxygen gas in a film-forming gas forforming the first non-single crystalline oxide semiconductor film is 10volume % or lower, and wherein a proportion of a flow rate of an oxygengas in a film-forming gas for forming the second non-single crystallineoxide semiconductor film is 70 volume % or higher.
 7. The methodaccording to claim 6, wherein the first non-single crystalline oxidesemiconductor film is formed at room temperature.
 8. The methodaccording to claim 6, wherein the second non-single crystalline oxidesemiconductor film is formed at room temperature.
 9. The methodaccording to claim 6, further comprising a step of heat treatment at atemperature of 250 to 500° C. after forming the source electrode and thedrain electrode.
 10. A method of manufacturing a semiconductor devicecomprising the steps of: forming a gate insulating film over a gateelectrode; forming a first non-single crystalline oxide semiconductorfilm by sputtering over the gate electrode with the gate insulating filminterposed therebetween; forming a second non-single crystalline oxidesemiconductor film by sputtering over the first non-single crystallineoxide semiconductor film, the second non-single crystalline oxidesemiconductor film having a lower electrical conductivity than the firstnon-single crystalline oxide semiconductor film; etching the firstnon-single crystalline oxide semiconductor film and the secondnon-single crystalline oxide semiconductor film to form a first oxidesemiconductor layer and a second oxide semiconductor layer on the firstoxide semiconductor layer; and forming a source electrode and a drainelectrode in electrical contact with the second oxide semiconductorlayer, wherein each of the first non-single crystalline oxidesemiconductor film and the second non-single crystalline oxidesemiconductor film comprises indium, gallium and zinc, wherein aproportion of a flow rate of an oxygen gas in a film-forming gas forforming the first non-single crystalline oxide semiconductor film islower than 70 volume %, and wherein a proportion of a flow rate of anoxygen gas in a film-forming gas for forming the second non-singlecrystalline oxide semiconductor film is 70 volume % or higher.
 11. Themethod according to claim 10, wherein the first non-single crystallineoxide semiconductor film is formed at room temperature.
 12. The methodaccording to claim 10, wherein the second non-single crystalline oxidesemiconductor film is formed at room temperature.
 13. The methodaccording to claim 10, further comprising a step of heat treatment at atemperature of 250 to 500° C. after forming the source electrode and thedrain electrode.
 14. A method of manufacturing a semiconductor devicecomprising the steps of: forming a gate insulating film over a gateelectrode; forming a first non-single crystalline oxide semiconductorfilm by sputtering over the gate electrode with the gate insulating filminterposed therebetween; forming a second non-single crystalline oxidesemiconductor film by sputtering over the first non-single crystallineoxide semiconductor film, the second non-single crystalline oxidesemiconductor film having a lower electrical conductivity than the firstnon-single crystalline oxide semiconductor film; etching the firstnon-single crystalline oxide semiconductor film and the secondnon-single crystalline oxide semiconductor film to form a first oxidesemiconductor layer and a second oxide semiconductor layer on the firstoxide semiconductor layer; and forming a source electrode and a drainelectrode in electrical contact with the second oxide semiconductorlayer, wherein each of the first non-single crystalline oxidesemiconductor film and the second non-single crystalline oxidesemiconductor film comprises indium, gallium and zinc, wherein aproportion of a flow rate of an oxygen gas in a film-forming gas forforming the first non-single crystalline oxide semiconductor film isfrom 0 to 11.1 volume %, and wherein a proportion of a flow rate of anoxygen gas in a film-forming gas for forming the second non-singlecrystalline oxide semiconductor film is 70 volume % or higher.
 15. Themethod according to claim 14, wherein the first non-single crystallineoxide semiconductor film is formed at room temperature.
 16. The methodaccording to claim 14, wherein the second non-single crystalline oxidesemiconductor film is formed at room temperature.
 17. The methodaccording to claim 14, further comprising a step of heat treatment at atemperature of 250 to 500° C. after forming the source electrode and thedrain electrode.